Heat conducting insulating film material and method for manufacturing same

A thin film material, heat conduction and insulation technology, applied in organic insulators, plastic/resin/wax insulators, cooling/ventilation/heating transformation, etc., can solve the problems of low heat conduction efficiency and affect the heat dissipation effect of electronic and electrical systems, and achieve low cost , easy processing and forming, simple process effect

Inactive Publication Date: 2008-12-31
晟茂(青岛)先进材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since these heat sinks are made of metal materials, some non-conductive insulating materials need to be used to separate them from the conductive parts of ele

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example one

[0022] Weigh 20kg cubic boron nitride, 10kg nano-zirconia, 10kg nano-molybdenum disulfide, and 60kg polyisobutylene, put them into the twin-screw extruder gradually, mix them at 150-170℃ for 3 hours, and extrude them in FEBOPP type three Stretching is carried out on the biaxially oriented film production line of layer co-extrusion. The thickness of the material obtained is 0.2mm, the thermal conductivity is 18W / m·K, and the volume resistance at 20°C is 1.0×10 5 m.

Example Embodiment

[0023] Example two

[0024] Weigh 15kg cubic boron nitride, 4kg nano-zirconia, 6kg nano-molybdenum disulfide, and 75kg polyisobutylene, gradually put them into the reactor, and mix them at 150-170℃ for 3 hours to obtain a thick, high-temperature mixed carbon mixing liquid . Then, the thick carbon mixed liquid is rolled into a sheet at a temperature of 200° C. and a pressure of 180 MPa. The thickness of the material obtained is 1.0mm, the thermal conductivity of the material obtained is 10W / m·K, and the volume resistance at 20°C is 0.6×10 5 m.

Example Embodiment

[0025] Example three

[0026] Weigh 10kg cubic boron nitride, 6kg nano-zirconia, 4kg nano-molybdenum disulfide, and 80kg polyisobutylene, put them into the reactor gradually, and mix at 150-170℃ for 3 hours to obtain a thick, high-temperature mixed carbon-making mixed liquid . Then, the thick carbon mixed liquid is rolled into a sheet at a temperature of 200° C. and a pressure of 200 MPa. The thickness of the material obtained is 0.8mm, the thermal conductivity is 6W / m·K, and the volume resistance at 20°C is 0.2×10 5 m.

[0027] The thickness of the thermally conductive insulating film material of the present invention is 0.01-3mm, the thermal conductivity is 5-20W / mK, and the volume resistance is 0.1×10 when the insulation performance is 20°C. 5 m~1.7×10 5 m. The specific volume resistance of cubic boron nitride is 1.7×10 at 20°C 5 m, 2.3×10 at 500℃ 12 m; The thermal conductivity is quite high, about 12.3-28.9W / (m·K). The described nano-zirconia D50 is 0.1-3 microns, and the spec...

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PUM

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Abstract

The invention relates to thermally conductive insulated film material and a fabrication method thereof. The material contains 8-20wt% of cubic boron nitride, 5-15wt% of nano zirconia, 2-10wt% of nano-molybdenum disulfide, and 60-85wt% of rubber material; wherein the rubber material is rubber material capable of withstanding rolling and biaxial tension, particularly polyisobutylene. The fabrication method is that: putting above materials based on mixture ratio into a reactor or a double screw extruder; mixing for 1-5h under 150-170 DEG C; molding through rolling at temperature of 100-250 DEG C and pressure of 100-300MPa; molding through stretching: firstly, fusing and extruding the sheet material or the thick film, then conducting biaxial stretching to the sheet material or the thick film; the film will be finished after certain cooling or heating treatment. The film is 0.01-3mm thick, with thermal conductivity of 5-20W/mK and volume resistivity of 0.1*10<5>m-1.7*10<5>m.

Description

technical field [0001] The invention relates to a film material, in particular to a thermally conductive and insulating film material and a manufacturing method thereof. Background technique [0002] At present, many electronic and electrical equipment will generate a large amount of heat. If the heat cannot be discharged in time, it will inevitably cause damage to the components of electronic and electrical appliances and the equipment itself if it accumulates to a certain extent. Usually, people use metal materials with high thermal conductivity, such as aluminum, aluminum alloy, copper, etc., to make heat sinks. However, since these heat sinks are made of metal materials, some non-conductive insulating materials need to be used to separate them from the conductive parts of electronic appliances during actual installation. Intervention will inevitably affect the improvement of the cooling effect of the entire electronic and electrical system. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): C08L21/00C08K3/30C08J5/18H01B3/30H05K7/20C08K3/22
Inventor 耿世达
Owner 晟茂(青岛)先进材料有限公司
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