Superconductor component and its implantation process

Abstract

The invention relates to a superconductive component and an implanting process thereof used for implanting aggregate into the superconductive component. The process at least comprises the following steps of: striking: a heat conducting metal plate material is used for striking a lower shell model and an upper cover model, wherein, the top of the upper cover is struck with a feed opening; modeling: the transfer printing technology is utilized to mold metal powder into a thin film embryonic type on the inside surfaces of the lower shell and the upper cover and into a plurality of convex cylindrical embryonic types on a plurality of fixed-points between the lower shell and the upper cover; sintering: the thin film embryonic type and the convex cylindrical embryonic types are heated to be sintered into the structure of capillary tissue; welding: a feed pipe is welded from the feed opening at the top of the cover; sealing: the upper cover is covered above the lower shell and the sealing is carried out along the engagement interface of the two by welding; feeding, a working substance is fed after the feed pipe is vacuumized and the feed pipe is cut and welded to be sealed.

Description

technical field [0001] The invention relates to a process for superconducting components, in particular to a process for using metal powder materials as implant aggregates. Background technique [0002] Under the trend of high integration and thinning of electronic products, electronic components have more powerful functions in a smaller volume. Higher and higher, the traditional heat dissipation method of fins dissipating in the air through fans can no longer meet the needs of the new generation of electronic components. Therefore, heat dissipation efficiency has become an important factor in determining the life, reliability and stability of electronic products. Heat pipe (Heat Pipe) absorbs heat through the phase change between the liquid and gas of the working fluid, and transmits heat through gas molecules, so it can obtain a very high heat transfer coefficient and have a very good heat transfer effect. It is widely used in the field of electronic heat conduction, such...

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Problems solved by technology

However, those who are familiar with this technology can understand that since the capillary structure of the heat pipe must be attached to the inner tube wall of the entire heat pipe, although it provides the capillary force for the backflow of the working medium liquid, the flow resistance inside the capillary structure Also becomes the main source of flow pressure drop, so its performance will be greatly degraded under certain operating conditions

[0003] The vapor chamber is to change the heat conduction of the heat pipe from the point to the heat conduction of the surface. It has higher heat conduction characteristics and is one of the heat conduction components that may be widely used in the future. The reason why it is not widely used at present is because the current stage Technology often has a soft structure due to the implantation process of capillary tissue aggregates, sintering and reflow during heat treatment, and the complex structure and failure to effectively save manufacturing costs have become another bottleneck

[0004] It is known that many documents related to vapor chambers have been proposed. For example, China Taiwan Invention Patent Publication No. 200609478 discloses a "manufacturing method for intermediate products of micro vapor chambers", which mainly uses stamping processing and etching processing methods, respectively Complete the processing steps of the intermediate products of the appearance of the micro-chambers and the microstructures, etc., and then complete the intermediate products that can be attached to each other to form a micro-chamber, so as to solve the problem that the micro-structures of the micro-chamber intermediate products are not easy to use stamping processing methods The problem of high cost of making molding and applying etching processing to the appearance of intermediate products

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