Method for light inducing light refraction change crystal surface microstructure

Abstract

The invention discloses a method for photoinduction photorefractive crystal surface microstructure, which comprises the following step: the first step, a photorefractive crystal is selected and irradiated with non uniform light; the space distribution of a space charge field is formed between the surface and the interior of the photorefractive crystal; the second step, the surface of the photorefractive crystal adopts micro-nano granules by electrophoresis or dielectrophoresis effect; and finally the micro structure which has corresponding relation with the space distribution of the space charge field is formed on the crystal surface. The invention provides the method for photoinduction photorefractive crystal surface which has simple operation, can prepare metal microstructure without needing an optical resist, simultaneously has no use for getting help from expensive devices with high pressure and high vacuum, and the like, and is beneficial to widely popularization and application.

Description

technical field [0001] The invention relates to the technical field of surface microstructure manufacture, in particular to a method for light-induced photorefractive crystal surface microstructure. Background technique [0002] The fabrication process of the surface microstructure of objects generally includes photolithography, etching, and ion beam sputtering, etc., and can also be realized by only one of them. [0003] Among them, lithography is usually divided into ultraviolet lithography, X-ray lithography, electron beam lithography, and focused ion beam lithography. In terms of specific implementation, after coating a layer of photoresist on the medium, a pattern (mask) of wavelength or sub-wavelength order is formed by photolithography. The etching mainly includes several methods such as atomic beam etching and ion beam etching, which can directly etch the required microstructure on the surface of the object. As for ion beam sputtering, a metal microstructure is pla...

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Problems solved by technology

[0005] However, the manufacturing method of the surface microstructure of the above-mentioned object is complicated to operate, and requires the use of photoresist and expensive equipment with high pressure and high vacuum, which is not conducive to wide application

[0006] In addition, due to the proximity effect of photoresist, it brings a lot of technological complexity to the transfer and etching of the pattern with glue, which is not conducive to the formation of surface microstructure.

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