Method for manufacturing micro-mechanical cantilever beam array with substrate silicon as fixing column

A manufacturing method and a cantilever beam technology are applied in the process, microstructure technology, microstructure device and other directions for producing decorative surface effects, which can solve the problems of cumbersome time-consuming, unsuitable for large-scale production, etc., and achieve low cost and high strength. The effect of practical value and high production efficiency

Inactive Publication Date: 2009-05-27
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

[0004] As we all know, this method involves a multi-step process, which is cumbersome and time-consuming, and is not suitable for large-scale production

Method used

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  • Method for manufacturing micro-mechanical cantilever beam array with substrate silicon as fixing column
  • Method for manufacturing micro-mechanical cantilever beam array with substrate silicon as fixing column
  • Method for manufacturing micro-mechanical cantilever beam array with substrate silicon as fixing column

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0025] Such as figure 1 as shown, figure 1 It is a flow chart of a method for manufacturing a micromechanical cantilever array based on substrate silicon as a fixed support provided by the present invention, and the method includes:

[0026] Step 101: Deposit SiN on both sides of the silicon substrate X Thin film; in this step, the LPCVD method is used for deposition.

[0027] Step 102: surface photolithography, etching SiN X thin film, form the corrosion window, and remove the glue; in this step, SF 6 Gas, isotropic etching of SiN at a flow rate of 60 to 70sccm and a power of 60 to 70w X The thin film reaches the silicon substrate, forming an etching window.

[0028] Step 103: Etching the silicon substrate to form...

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Abstract

The invention discloses a method for producing a micromechanical cantilever array taking substrate silicon as a clamping support, which comprises the following steps: a <100> silicon substrate is double-sidedly deposited with SiNx thin films; the surface lithography is performed, wherein the SiNx thin films are etched to form corrosion windows, and a photoresist is removed; the silicon substrate is corroded to form a square cantilever array with a substrate silicon clamping column at the center; and the frontal lithography is performed, wherein the SiNx thin films are etched, and the photoresist is removed to form a rectangular cantilever array with single-point clamped supporting, symmetry and high length-width ratio, or form a rectangular cantilever array clamped at one end. The utilization of the method simplifies a production process and can adapt to the requirement of mass production.

Description

technical field [0001] The invention relates to the technical field of micromachine (MEMS) manufacturing in microelectronic technology, in particular to a method for manufacturing a micromachine cantilever beam array based on substrate silicon as a solid support. Background technique [0002] In MEMS manufacturing technology, silicon-based surface micromachining technology is an important component, which avoids vertical bulk silicon deep processing, has better compatibility with integrated circuit technology, and is conducive to the integration of structural devices and processing circuits. [0003] In the process of silicon-based surface micromachining, "sacrificial layer" technology is used to manufacture suspended beams, membranes or cavity structures, that is, through the steps of sacrificial layer deposition, etching, deposition of solid pillars and structural layer films. Finish. [0004] As we all know, this method involves a multi-step process, which is cumbersome ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 石莎莉陈大鹏景玉鹏欧毅叶甜春
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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