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38results about How to "Avoid process steps" patented technology

Composite materials

InactiveUS20070082172A1Acceptable sound-absorbent propertyReduce usageSynthetic resin layered productsLaminationFiberWater based
A noise reducing composite material for use in automotive applications, and methods for preparing the material, are disclosed. The composite includes a carpet layer and a noise reducing layer. The carpet layer can be a tufted carpet layer that includes a primary backing in which to position tufts of yarn, and a latex layer to lock in the tufts of yarn, or a nonwoven carpet layer with a coating of latex to lock in the fibers. The noise reducing layer is adhered to the carpet layer. The latex layer includes, as an additive, an adhesive of sufficient type and quantity to adhere the noise reducing layer to the carpet layer. Latex dispersions including such additives, which can be used to form the latex layer in the composite material, are also disclosed. Examples of noise reducing layers include heavily filled EVA, shoddy, and foam layers. For adhering shoddy and/or foam layers, the additive in the latex layer is a polyolefin, such as polyethylene. For adhering filled EVA layers, the additive in the latex layer is a water-based adhesive such as an ethylene acrylic acid ammoniated dispersion. The composite carpet materials described herein represent an improvement over the existing carpet materials, in that they can be manufactured using wet steps, without the need for organic solvents, and reduce the number of process steps by eliminating the need for an extruded polyethylene layer.
Owner:MALLARD CREEK POLYMERS

Chip packaging method and chip packaging structure

The invention provides a chip packaging method and a chip packaging structure, wherein the chip packaging method comprises the steps of providing a first chip which comprises a first surface and a second surface that oppose each other, wherein the first surface of the first chip is provided with a plurality of first pads; providing a second chip with a third surface and a fourth surface that oppose each other, wherein the third surface of the second chip is provided with a plurality of second pads and the area of the second chip is larger than that of the first chip; providing a carrier plate; combining the fourth surface of the second chip with the surface of the carrier plate, wherein the plurality of second pads are arranged outside the combining area between the first chip and the second chip; forming a sealing material layer on the surface of the carrier plate, wherein the sealing material layer packages the first chip and the second chip; and forming a first conductive structure and a second conductive structure in the sealing material layer, wherein the first conductive structure is electrically connected with the first pads and the second conductive structure is electrically connected with the second pads. A package which is formed according to the chip packaging method has advantages of reduced structural dimension, improved stability and improved reliability.
Owner:CHINA WAFER LEVEL CSP

Steel security door section and hemming process

The invention relates to a steel security door leaf and a crimping process thereof. The steel security door leaf comprises a front door plate and a rear door plate, wherein a door core is filled in a cavity between the front door plate and the rear door plate. The steel security door leaf is characterized in that the side part of the front door plate is folded for 180 degrees inward, so as to cover the edge of the rear door plate, and form a three-layer sandwich-shaped fitted covered edge. The covered edge and the main body of the front door plate form a bending angle larger than and equal to 45 degrees. The crimping process comprises the following steps: (a), the side part of the front door plate is bent upwards, and the bending angle is larger than and equal to 90 degrees; (b), one open side of the cavity of the rear door plate is stuck to one side towards which the side part of the front door plate is bent, and the convex edge of the rear door plate is fitted with the front door plate; (c), the bent part of the front door plate is folded inwards, so as to cover the convex edge of the rear door plate, and the three-layer sandwich-shaped fitted covered edge is formed; and (d), the three-layer sandwich-shaped fitted covered edge is bent towards the inverse direction of the opening of the cavity of the rear door plate, and the overall bending angle is larger than and equal to 45 degrees. The steel security door leaf and crimping process have the advantages that the overall structural performance of the door leaf is good, and the strength is high; and the crimping process can avoid the spot welding process step.
Owner:陈少林

Analysis method for gold content of gold-containing ore sample

The invention discloses an analysis method for the gold content of a gold-bearing ore sample, which comprises the following steps of: crushing and weighing the gold-bearing ore sample to be detected, sorting out reselected concentrate and reselected tailings through reselection equipment, analyzing the gold content of the reselected concentrate and the reselected tailings through a gold content detection method respectively, and determining the gold content of the gold-bearing ore sample after the results of the reselected concentrate and the reselected tailings are processed. The gold content of the reselected concentrate is detected by the fire assaying method according to the weight suitable for fire assaying method detection. According to the invention, a division process step is avoided, and the sampling range of the gold-containing ore sample to be detected is expanded, so that the detection result is accurate and real. Since the gold ore is different from other ores, the gold content is relatively low and the gold is scattered in the ores, a representative detection result is difficult to obtain if an existing detection method is adopted. The positive deviation and the negative deviation of the detection result of the conventional method represented by the embodiment of the invention are respectively 16-38% and 9-18%, and compared with the existing detection method, the method disclosed by the invention can reduce 75% of data fluctuation to the maximum extent.
Owner:江西省地质调查研究院
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