Etchant

An etchant and weight technology, applied in the direction of surface etching composition, removal of conductive materials by chemical/electrolytic methods, chemical instruments and methods, etc. The effect of preventing the reduction of dimensional accuracy

Active Publication Date: 2009-06-03
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in the case of thin line patterns with lines / spaces smaller than 20 μm / 20 μm, even if undercut UC occurs slightly, the ratio of the undercut length UCL to the width W of the wiring 2 increases, which may cause a decrease in the dimensional accuracy of the wiring pattern, breakage, etc. line, missing, etc.

Method used

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Examples

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Embodiment

[0048] Furthermore, examples of the etchant according to the present invention will be described together with comparative examples. In addition, this invention is not limited to the following Example and interpreted.

[0049] Each item was evaluated by the measuring method shown below using the etchant of the composition shown in Tables 1-4. Examples 1 to 23 shown in Table 1 and Table 2 are examples of the above-mentioned first etchant of the present invention, and Examples 24 to 33 shown in Table 3 are examples of the above-mentioned second etchant of the present invention. In addition, Table 4 shows comparative examples. Each etchant was prepared by first dissolving metallic copper at a ratio of 25 g / L in a solution obtained by dissolving sulfuric acid and hydrogen peroxide in ion-exchanged water, and then adding the remaining components. In addition, the compounding quantity of each component shown in Tables 1-4 shows the weight ratio of each component with respect to th...

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Abstract

The present invention provides an etchant, capable of preventing dimensional precision of a wiring pattern from reducing when removing a chemical copper plate in a half addition process. A first etchant of the invention is characterized in that it is a copper etchant containing sulphuric acid, hydogen peroxide and water, and containing more than two benzotriazole derivates containing at least oneof carboxyl and dydroxyl in a molecule. A second etchant of the invention is characterized in that it is a copper etchant containing sulphuric acid, hydogen peroxide and water, and containing pyrrolehaving heteroatom of nitrogen atom only in a loop, and polyprotic acid having more than two carboxyl or salts thereof.

Description

technical field [0001] This invention relates to copper etchant containing sulfuric acid, hydrogen peroxide and water. Background technique [0002] In the manufacturing process of a printed wiring board, there exists a semi-additive method as a method of forming a wiring pattern. In this semi-additive method, a seed layer consisting of an electroless copper plating layer of about 0.5 to 2 μm is formed on the electrical insulating layer, and after forming a conductor circuit with electroplating copper on it, the unnecessary electroless copper plating is removed by etching. layer to form a wiring pattern. As such an etchant for removing the electroless copper plating layer, an etchant containing pyrroles is known, for example, in persulfate-based etchant, hydrogen peroxide-sulfuric acid-alcohol-based etchant, copper chloride etchant, It is used after adding pyrroles to ferric chloride etching liquid etc. (refer patent documents 1-4). [0003] However, for the addition of p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/06
CPCC09K13/06C23F1/16C23F1/18
Inventor 中村真美秋山大作吉海雅史
Owner MEC CO LTD
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