Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Etchant

An etchant and weight technology, applied in the direction of surface etching composition, removal of conductive materials by chemical/electrolytic methods, chemical instruments and methods, etc. The effect of preventing the reduction of dimensional accuracy

Active Publication Date: 2009-06-03
MEC CO LTD
View PDF7 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in the case of thin line patterns with lines / spaces smaller than 20 μm / 20 μm, even if undercut UC occurs slightly, the ratio of the undercut length UCL to the width W of the wiring 2 increases, which may cause a decrease in the dimensional accuracy of the wiring pattern, breakage, etc. line, missing, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Etchant
  • Etchant
  • Etchant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0048] Furthermore, examples of the etchant according to the present invention will be described together with comparative examples. In addition, this invention is not limited to the following Example and interpreted.

[0049] Each item was evaluated by the measuring method shown below using the etchant of the composition shown in Tables 1-4. Examples 1 to 23 shown in Table 1 and Table 2 are examples of the above-mentioned first etchant of the present invention, and Examples 24 to 33 shown in Table 3 are examples of the above-mentioned second etchant of the present invention. In addition, Table 4 shows comparative examples. Each etchant was prepared by first dissolving metallic copper at a ratio of 25 g / L in a solution obtained by dissolving sulfuric acid and hydrogen peroxide in ion-exchanged water, and then adding the remaining components. In addition, the compounding quantity of each component shown in Tables 1-4 shows the weight ratio of each component with respect to th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention provides an etchant, capable of preventing dimensional precision of a wiring pattern from reducing when removing a chemical copper plate in a half addition process. A first etchant of the invention is characterized in that it is a copper etchant containing sulphuric acid, hydogen peroxide and water, and containing more than two benzotriazole derivates containing at least oneof carboxyl and dydroxyl in a molecule. A second etchant of the invention is characterized in that it is a copper etchant containing sulphuric acid, hydogen peroxide and water, and containing pyrrolehaving heteroatom of nitrogen atom only in a loop, and polyprotic acid having more than two carboxyl or salts thereof.

Description

technical field [0001] This invention relates to copper etchant containing sulfuric acid, hydrogen peroxide and water. Background technique [0002] In the manufacturing process of a printed wiring board, there exists a semi-additive method as a method of forming a wiring pattern. In this semi-additive method, a seed layer consisting of an electroless copper plating layer of about 0.5 to 2 μm is formed on the electrical insulating layer, and after forming a conductor circuit with electroplating copper on it, the unnecessary electroless copper plating is removed by etching. layer to form a wiring pattern. As such an etchant for removing the electroless copper plating layer, an etchant containing pyrroles is known, for example, in persulfate-based etchant, hydrogen peroxide-sulfuric acid-alcohol-based etchant, copper chloride etchant, It is used after adding pyrroles to ferric chloride etching liquid etc. (refer patent documents 1-4). [0003] However, for the addition of p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/06
CPCC09K13/06C23F1/16C23F1/18
Inventor 中村真美秋山大作吉海雅史
Owner MEC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com