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Near-infrared single photon detector

A single photon detector and detector technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as large noise, complex process, and low repeatability

Inactive Publication Date: 2009-06-24
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

[0003] Existing single photon detectors use holes to cause avalanche multiplication to amplify the optical signal. The material of the multiplication layer is InP. However, the hole mobility is low and the detection frequency band of the detector is suppressed. In addition, , the ionization rate of holes and electrons in the InP material is closer, which makes the detector have a larger noise factor; the increase in the thickness of InGaAs is used to improve the quantum efficiency of the detector, which also limits the detection frequency
In addition, due to the high requirements of the manufacturing process, the infrared single photon detectors currently on the market have disadvantages such as low detection efficiency, high noise, complex process, and low repeatability.

Method used

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Embodiment Construction

[0028] Combine below figure 1 The details of the near-infrared single photon detector according to the embodiment of the present invention are described in detail.

[0029] A substrate 11, which is used for epitaxial growth of the materials of each layer of the detector;

[0030] The buffer layer 12, which is fabricated on the substrate 11, is a non-doped n-type InP material. Its purpose is to form a high-quality epitaxial surface, reduce the stress between the substrate and other layers, eliminate the propagation of substrate defects to other layers, and facilitate the growth of other layers of the device;

[0031] The N-type ohmic contact layer 13, which is made on the buffer layer 12, is heavily doped N-type InAlAs, and its purpose is to achieve a good ohmic contact. The heavy doping is used to reduce the series resistance. Improve the conversion efficiency of the device;

[0032] Superlattice multiplication layer 14, this superlattice multiplication layer is made on the...

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Abstract

The invention discloses a near infrared single-photon detector which comprises a substrate, a cushioning layer, an N-type ohmic contact layer, a superlattice multiplication layer, an electric filed control layer, a bandgap gradient layer and a light absorbing layer. Through the introduction of the superlattice structure and an absorbing layer gradient structure, the performance of the detector is improved; particularly, the detection frequency and noise influence of the detector are greatly improved, so that the gain bandwidth product of the detector can be effectively improved. In addition, the detector is provided with simple process and high repeatability.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a near-infrared single-photon detector for detecting near-infrared weak light signals. Background technique [0002] Single-photon detection technology is used in high-resolution spectral measurement, non-destructive material analysis, high-speed phenomenon detection, precision analysis, atmospheric pollution measurement, bioluminescence, radiation detection, high-energy physics, astrophotometry, optical time domain reflection, quantum key Distribution systems and other fields have a wide range of applications. Especially in recent years, the research on quantum communication technology and quantum cryptography has attracted the attention of various countries, and the research on single photon detectors in the infrared communication band is particularly urgent. [0003] Existing single photon detectors use holes to cause avalanche multiplication to amplify the optical signal...

Claims

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Application Information

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IPC IPC(8): H01L31/101
Inventor 曹延名吴孟杨富华
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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