Nano cable composed of semimetal bismuth and metallic copper and method for synthesizing the same
A technology of nano-cables and synthesis methods, which is applied in nanotechnology, nanotechnology, nanostructure manufacturing, etc., and can solve the problem of small heterojunction contact surface, difficulty in fully exerting the effect of nano-heterojunction, and failure to produce nanotubes and nanostructures. line and other problems, to achieve the effect of scientific preparation method
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Embodiment 1
[0016] Example 1: The preparation is completed sequentially according to the following steps: first step, the aluminum sheet is first placed in an acid solution with a concentration of 0.2M, anodized at a DC voltage of 30V for 10h, and then placed in a 4wt solution at a temperature of 50°C % phosphoric acid and 2wt% chromic acid mixed solution for 12h; wherein, the purity of the aluminum sheet is 99.9%, and the acid solution is oxalic acid solution. Then, after it was anodized for the second time under the same process conditions, the unoxidized aluminum on the back was removed with a supersaturated tin tetrachloride solution, and then the oxidized aluminum at the bottom of the hole was etched away with a 3wt% phosphoric acid solution. The aluminum barrier layer is used to obtain a through-hole alumina template with a pore diameter of 50 nm. In the second step, after evaporating a 10nm thick gold film on one side of the through-hole alumina template by electron beam evaporatio...
Embodiment 2
[0017] Example 2: The preparation is completed in sequence according to the following steps: first step, the aluminum sheet is first placed in an acid solution with a concentration of 0.25M, anodized at a DC voltage of 70V for 9h, and then placed in a 5wt solution at a temperature of 55°C % phosphoric acid and 1.9wt% chromic acid mixed solution for 11 hours; wherein, the purity of the aluminum sheet is 99.9%, and the acid solution is oxalic acid solution. Then, it is again anodized for the second time under the same process conditions, and the unoxidized aluminum on the back is removed with a supersaturated tin tetrachloride solution, and then the oxidized aluminum at the bottom of the hole is etched away with a 4wt% phosphoric acid solution. The aluminum barrier layer is used to obtain a through-hole alumina template with a pore diameter of 90 nm. In the second step, after evaporating a 15nm thick gold film on one side of the through-hole alumina template by electron beam eva...
Embodiment 3
[0018] Example 3: The preparation is completed in sequence according to the following steps: first step, the aluminum sheet is first placed in an acid solution with a concentration of 0.3M, anodized at a DC voltage of 100V for 8 hours, and then placed in a 6wt solution at a temperature of 60°C % phosphoric acid and 1.8wt% chromic acid mixed solution for 10h; wherein, the purity of the aluminum sheet is 99.9%, and the acid solution is oxalic acid solution. Then, it is again anodized for the second time under the same process conditions, and the unoxidized aluminum on the back is removed with a supersaturated tin tetrachloride solution, and then the oxidized aluminum at the bottom of the hole is etched away with a 5wt% phosphoric acid solution. The aluminum barrier layer is used to obtain a through-hole alumina template with a pore diameter of 130 nm. In the second step, after evaporating a 25nm thick gold film on one side of the through-hole alumina template by electron beam ev...
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