Alloying technique for semiconductor chip Au-Si solder

Abstract

The invention discloses an alloying process for a semiconductor chip alloyed silicon solder. The alloying process comprises the following steps: S1, carrying out the surface treatment of a silicon slice to be alloyed; S2, coating one or a plurality of metallic layers on the back of the silicon slice subjected to the surface treatment by vaporization on the vacuum condition; and S3, sending the silicon slice coated with the metallic layers into a quick anneal oven for alloy treatment with the temperature of 490 to 550 DEG C and the time of 10 to 50 seconds. The alloying process replaces a conventional tubular type alloying furnace by the quick anneal oven which has the characteristics of accurate temperature control, quick temperature increase and decrease and short processing time in the process. In addition, the application of the quick anneal oven realizes the input and output of a single silicon slice so as to replace the tubular type alloying furnace which has the batch charge and discharge of hundreds of slices each time, make the silicon slice heated evenly, and consequently greatly improve the yield.

Description

【Technical field】 [0001] The invention relates to the technical field of semiconductor device manufacturing technology, in particular to an alloy process of gold-silicon solder for semiconductor chips. 【Background technique】 [0002] After the power transistor chip is manufactured, the collector must be prepared to be packaged into a finished product, and the collector must solve the problem of metal and semiconductor contact. In general, the purpose of metallization on the back of the power transistor chip is to make the collector form a good ohmic contact. The metallized chip on the back has the advantages of small saturation voltage drop (Vcesat), reliable welding, and easy automatic production. There are two processes for the preparation of the collector: the first is the solder process, which uses silver as the solder layer, and solder is added to bond the die and the base; the second is the eutectic process, which uses Solder is a thin layer of alloy, generally gold s...

AI Technical Summary

Problems solved by technology

[0004] At present, in the domestic gold-silicon solder eutectic process, the tubular alloy furnace is basically used to alloy the gold-silicon solder. The problem with the alloy in the tubular alloy furnace is that the gold-silicon solder after alloying has no shear force or silicon residue locally. Less, it needs to add friction to stick well when sticking the film, and adding friction will greatly reduce the sticking efficiency and affect the output

Images