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Photosensitive resin composition, photosensitive film, and method for formation of pattern

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of poor resin storage stability, toxicity of acrylate, inability to be precise in addition reaction, etc., and achieve excellent thermal decomposition property and less shrinkage. Effect

Inactive Publication Date: 2009-09-09
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when using this method, there are the following disadvantages: the addition reaction between the resin having carboxyl group or hydroxyl group and the (meth)acrylate containing isocyanate group cannot be carried out precisely, and the storage stability of the resin generated in the addition reaction Poor and isocyanate-containing (meth)acrylates are toxic

Method used

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  • Photosensitive resin composition, photosensitive film, and method for formation of pattern
  • Photosensitive resin composition, photosensitive film, and method for formation of pattern
  • Photosensitive resin composition, photosensitive film, and method for formation of pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-12

[0204] [Evaluation method of pattern after development (Examples 1-12, Comparative Examples 1-7)]

[0205] The developed panel test piece (150 mm x 150 mm x 2.8 mm) was cut and observed with a scanning electron microscope (manufactured by Hitachi, Ltd. "S4200") figure 2 The cross-section of the pattern at the indicated position was measured, and the width and height of the pattern were measured, and evaluated according to the following criteria, respectively. Required specifications are a pattern width of 50 μm, a height of 180 μm, and a spacing of 200 μm.

[0206] A: Within ±3 μm of the required specification.

[0207] B: Exceeding the required specification by ±3 μm and within ±5 μm.

[0208] C: Exceeds the required specification by ±5 μm and is within ±10 μm.

[0209] D: Exceeds the required specification by ±10 µm.

[0210] [Evaluation method of pattern after sintering (Examples 1-12, Comparative Examples 1-7)]

[0211] The sintered panel test piece (150mm×150mm×2.8m...

Synthetic example A1

[0236] 55g of benzyl methacrylate, 45g of 2-methacryloxyethyl phthalate, 1g of azobisisobutyronitrile (AIBN), 5g of tetrakis(3-mercaptopropionic acid)pentaerythritol ester (Sakai Chemical Industry Co., Ltd. Co., Ltd.) was added into an autoclave with a stirrer, and stirred in 150 parts of propylene glycol monomethyl ether until uniform under a nitrogen atmosphere. Then polymerize at 80°C for 4 hours, then continue to carry out the polymerization reaction at 100°C for 1 hour, and then cool to room temperature to obtain a methacrylic resin (A1) with SH groups (hereinafter also referred to as "SH group-containing Methacrylic Resin (A1)"). The polymerization ratio of the SH group-containing methacrylic resin (A1) was 98%, and the weight average molecular weight of the SH group-containing methacrylic resin (A1) was 20000 (Mw / Mn: 1.8). The IR spectrum of the obtained resin is as image 3 shown.

Synthetic example A2

[0238] Using 5 g of bis(3-mercaptopropionate) tetraethylene glycol ester (manufactured by Sakai Chemical Industry Co., Ltd.) instead of tetrakis(3-mercaptopropionate) pentaerythritol ester, in the same manner as in Synthesis Example A1, a compound having an SH group was obtained. Methacrylic resin (A2) (hereinafter also referred to as "SH group-containing methacrylic resin (A2)"). The polymerization ratio of the SH group-containing methacrylic resin (A2) was 98%, and the weight average molecular weight of the SH group-containing methacrylic resin (A2) was 15000 (Mw / Mn: 1.7).

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Abstract

The invention provides a photosensitive resin composition which can form a highly precise pattern, has excellent thermal degradability of an organic component, and shows less shrinking after firing. The composition comprises an alkali-soluble resin (A) having at least one SH group, a polyfunctional (meth)acrylate (B), a photopolymerization initiator (C) and an inorganic particle (D). The invention also discloses a method for forming a pattern by using the composition.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photosensitive film and a pattern forming method. More specifically, it relates to a high-performance encapsulating material for use in display panels such as flat-panel displays and electronic components having a display unit composed of dielectrics, electrodes, resistors, phosphors, spacers, color filters, and black matrices. In the preparation of a circuit substrate of a microcircuit pattern, a photosensitive resin composition having excellent thermal decomposability of an organic component and suitable for forming a high-precision pattern; a photosensitive film having a photosensitive resin layer containing the resin composition; and using The composition or the pattern forming method of the photosensitive film. Background technique [0002] In recent years, there has been an increasing demand for higher density and higher definition in patterning of circuit boards and display ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/033G02B5/20G03F7/004G03F7/027G03F7/40H01J9/02H01J9/227H01J11/02H01J17/49
CPCG03F7/0007G03F7/033G03F7/027H01J9/02H01J9/242H01J11/12G03F7/0047G03F7/028G03F7/029
Inventor 工藤和生吉田武司增子英明板野考史
Owner JSR CORPORATIOON
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