Resistance welding superposition technology for PCB thick copper lines

Abstract

The invention discloses a resistance welding superposition technology for PCB thick copper lines, comprising the steps of: at first, printing resistance welding ink on the surface of a PCB and forming a first resistance welding layer via screen printing resistance welding; and pre-drying while remaining 75 DEG C and semi-hardening the first resistance welding layer after cooling; then printing the resistance welding on the first resistance welding layer once again in order to form a second resistance welding layer; pre-drying once again while remaining 75 DEG C and semi-hardening the first resistance welding layer and the second resistance welding layer after cooling; eventually, hardening the resistance welding layer and the second resistance welding layer completely subsequent to the segmented baking of the semi-hardened PCB. The invention requires only one-time resistance welding pattern transfer and high-temperature baking by the superposition printing on the thickness of the resistance welding, which increases the thickness of the resistance welding layer, thickens, in particular, the thickness of the resistance welding layer at corners of the lines, and avoids the problems of resistance welding blistering and falling in thermal impact procedures of post-processing procedure, and meanwhile, using the inventive technology shortens production procedure dramatically, speeds up production schedule and lowers production cost.

Description

Technical field: [0001] The invention relates to PCB board manufacturing technology, in particular to a PCB board thick copper circuit solder resist overlay process. Background technique: [0002] The green or other colors on the printed circuit board (PCB) are the color of the solder mask (solder mask). This layer of ink is a protective layer that insulates and prevents soldering. It is called a solder mask. The solder mask is formed by a permanent polymer solder resist coating material. It is used to limit and control the solder in the printed board assembly soldering operation. On the selected area, at the same time in the welding and subsequent process operations, control and reduce the pollution of the printed board surface, and sometimes the solder resist is also used to reduce the dendrites between the conductor patterns on the surface of the printed board substrate Filaments grow. [0003] The solder mask layer covers most of the copper surface of the circuit, and only ex...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the present invention provides a kind of solder mask overprinting process of thick copper circuit of PCB board, to solve the problem that the solder mask thickness of the circuit corner is relatively thin caused by the thicker copper layer of the existing PCB board circuit, and the conventional operation process method is two resistors. Welding pattern transfer process, resulting in the disadvantages of long production process and high production cost