Surface metallised ceramic and manufacturing method thereof

一种陶瓷、界面的技术，应用在表面金属化陶瓷及其制造领域，能够解决铝液无法进入、不能制造薄膜、制备薄膜困难等问题，达到良好物理和力学性能的效果

Inactive Publication Date: 2014-09-17
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are also defects in the above method, that is, it is difficult to prepare thin films, especially thin films with a thickness less than 0.1 mm.
This is because the method uses a casting mold, and the casting mold must choose a material that does not react with aluminum and does not wet. If the mold gap is too small, the aluminum liquid cannot enter the casting mold, so the thin film cannot be produced.

Method used

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  • Surface metallised ceramic and manufacturing method thereof
  • Surface metallised ceramic and manufacturing method thereof
  • Surface metallised ceramic and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1, adopt above-mentioned ceramic surface metallization device, put pure aluminum (99.9%) into graphite crucible, alumina ceramic plate (long 137mm, wide 35mm, thick 0.64mm, produced by Tsinghua Yueke, the purity of alumina is greater than 95 %) into the graphite guide rail passing through the crucible, and then heated in a nitrogen atmosphere (nitrogen flow rate is 20 liters / min) to melt the aluminum and raise the temperature to 730°C. Insert another alumina ceramic plate into the guide rail at a speed of 68.5mm / min from the guide rail entrance at the lower part of the device, and push the ceramic plate inserted into the guide rail to move vertically upward at the same speed. During the moving process, the ceramic plate contacts the aluminum melt in the crucible through the window on the guide rail, and then pushes out from the upper part of the guide rail together with the aluminum melt adhered to the surface, cools, and forms a thickness of about 6 microns o...

Embodiment 2

[0031] Embodiment 2, except that the melt temperature is reduced to 700° C., is the same as embodiment 1. Form a dense aluminum film with an average thickness of 7 microns on the surface of the ceramics by this method, and the stripping rate of the adhesive tape test is 0. The experiment was repeated 3 times with the same results.

Embodiment 3

[0032] Embodiment 3, except that the melt temperature is increased to 760° C., is the same as embodiment 1. This method is used to form a dense aluminum film with an average thickness of 5 microns on the surface of the ceramics, and its tape test peeling rate is 0. The experiment was repeated 3 times with the same results.

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PUM

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Abstract

The invention discloses a surface metallised ceramic and a manufacturing method thereof. The method comprises the following operation steps of immersing a metallised surface of the ceramic in an aluminium or aluminium alloy melt, making the metallised surface move with respect to the melt such that the aluminium or aluminium alloy melt wets the metallised surface of the ceramic, taking out the metallised surface of the ceramic from the melt and freely cooling the aluminium or aluminium alloy film attached to the surface, so as to obtain the ceramic with the surface connected with the aluminium or aluminium alloy film. Compared with prior art, the interface between the ceramic and the aluminium or the aluminium alloy film in the invention does not contain amorphous oxide. The aluminium or aluminium alloy crystal grains and the ceramic crystal grains are grown together. The internal organisations of the formed film are compact and do not contain oxide. The formed aluminium or aluminium alloy film has a thickness in a range from several microns to more than ten microns, is firm, and cannot easily fall off. The chessboard division peeling strength between the aluminium or the aluminium alloy film and the ceramic is proved, by experiments, to be greater than or equal to 4.1N / cm. The invention has wide application prospect in the surface metallising field of ceramic.

Description

technical field [0001] The invention relates to a surface metallized ceramic and a manufacturing method thereof. Background technique [0002] Ceramic has good thermal conductivity and insulation properties, and is a good packaging material. When used, it is generally necessary to carry out surface metallization treatment on ceramics to make circuits or solder electronic components. Traditional surface metallization methods include precious metal paste sintering method, Mo-Mn method, DBC method and active metal brazing method. Among them, the precious metal paste sintering method is to mix precious metal powder such as silver powder and glass powder, add binder, etc., prepare a slurry, coat it on the ceramic surface, and then sinter at about 900 ° C to form a surface precious metal layer; Mo-Mn method is Mix molybdenum powder and manganese oxide powder to make a slurry, coat it on the ceramic surface, and then sinter at 1500°C to form a surface metal molybdenum layer; the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/88
Inventor 宁晓山李国才王波李莎
Owner TSINGHUA UNIV
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