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Target material structure and method for producing the same

A production method and target technology, which are applied in the fields of manufacturing tools, heat treatment process control, metal material coating process, etc. Effect

Active Publication Date: 2009-09-30
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking tantalum target and copper back plate as an example, since tantalum is a relatively stable metal element, copper is an easily oxidized metal element, and oxidation will occur on the welding surface, resulting in poor welding tightness, and the target and back Boards are difficult to bond by direct diffusion soldering

Method used

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  • Target material structure and method for producing the same
  • Target material structure and method for producing the same
  • Target material structure and method for producing the same

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Embodiment Construction

[0026] The inventors of the present invention have found that when making the target structure, if the properties of the target are relatively stable (for example, the melting point of the tantalum target is relatively high), and the properties of the back plate are relatively active (for example, the surface of the copper back plate is easily oxidized), it is better to use welding Direct welding of the target and the backplane will result in a poor combination of the two. In view of this, it is proposed to add an adhesive layer as an intermediate medium between the target and the back plate, so that the target and the back plate can be made combination to complete the fabrication of the target structure. Therefore, according to one aspect of the present invention, a target structure is provided, wherein an adhesive layer is included between the target and the back plate.

[0027] The inventor of the present invention proposes a method for making a target structure, such as ...

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Abstract

The present invention provides a target material structure and a method for producing the same. The method includes a step of providing the target material; a step of forming a bonding layer on a welding face of the target material; a step of implementing a diffusion weld treatment on the bonding layer, and welding a back board to the target material. Comparing with the present technology, the method of the invention may ensure the combination of a tantalum target material and a copper back board to be reliable, and the quality of the target material structure is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a target structure and a manufacturing method thereof. Background technique [0002] Physical vapor deposition (PVD) techniques, such as sputtering, are used in many fields to provide thin film material deposits with precisely controlled thicknesses with atomically smooth surfaces. During sputtering, a target in a chamber filled with an inert gas atmosphere is exposed to an electric field to create a plasma. The plasma in this plasma region collides with the surface of the sputtering target, causing the target to escape atoms from the target surface. The voltage difference between the target and the substrate to be coated causes the escaped atoms to form the desired film on the surface of the substrate. [0003] Generally, the target assembly is composed of a target meeting the sputtering performance and a back plate combined with the target and having a certain stren...

Claims

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Application Information

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IPC IPC(8): B23K20/00B23K20/24C23G1/10C23C14/34C23C14/30C23C14/16C23C14/54C21D9/50C21D11/00B23K1/00B23K1/20C23G5/02B23K103/08B23K103/18B23K103/12B23K103/10
Inventor 姚力军潘杰毛立鼎刘庆
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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