Method for preparing point contact electrode at back of solar cell by utilizing laser induced thermit reaction
A backside point contact and thermite reaction technology, applied in the field of solar energy, can solve the problems of reducing battery short-circuit current, failure to form ohmic contact, material damage, etc., to increase short-circuit current and open-circuit voltage, reduce carrier recombination rate, reduce The effect of small damage
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2009-09-30
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention belongs to the technical field of solar energy, and in particular relates to a method for preparing solar cell electrodes. Background technique
[0002] Exploring new processes for solar cells to reduce costs while improving conversion efficiency is the only way to industrialize solar energy. The recombination on the back surface of the silicon wafer has a great influence on the efficiency of solar cells. The existing electrode sintering process forms a metal-semiconductor interface on the entire back of the solar cell, which has a high minority carrier recombination speed, resulting in low short-circuit current of the solar cell. Therefore, the back electrode of the point contact method has attracted more and more attention. It can reduce the area of the metal-semiconductor contact area, thereby effectively reducing the surface recombination rate of the solar cell, and has a great effect on improving the performance of the solar cell,...
Examples
Embodiment Construction
[0018] The method for preparing a point-contact electrode on the back of a solar cell by using laser-induced thermite reaction provided by the present invention comprises the following steps:
[0019] (1) The front surface of the silicon substrate 1 is cleaned and textured, diffused to obtain the front surface emission junction region 9, and the front surface anti-reflection film 10 (such as SiNx: H or SiO 2 etc.), prepare the front silver grid line electrode 11, such as figure 1 shown;
[0020] (2) Coating a layer of passivation dielectric layer (2) (such as SiNx: H or SiO on the back side of silicon substrate 1 2 etc.), such as figure 2 shown;
[0021] (3) A layer of aluminum layer 3 is vapor-deposited on the passivation medium layer 2, the thickness of the aluminum layer 3 is 0.1-10um, such as image 3 shown;
[0022] (4) Printing or coating dot-shaped thermite 4 arranged in a certain array on the aluminum layer 3, such as Figure 4 shown;
[0023] (5) Ignite therm...