Method for preparing hollowed-out polyimide evaporation shadow mask

Abstract

The invention discloses a method for preparing an evaporation shadow mask for manufacturing semiconductor devices, which comprises the process steps: 1, forming a polyimide film layer on a silicon chip substrate with double-sided polishing; 2, forming a photoresist pattern on the polyimide film layer; 3, evaporating a metal layer on a polyimide layer and a photoresist pattern layer; 4, peeling to form a metal barrier layer; 5, corroding a silicon substrate from the back side under the protection of a fixture to form a hollowed-out polyimide self-supporting film; 6, performing reactive ion etching from the right side under the masking of the metal barrier layer to form a polyimide mask pattern; and 7, removing the metal barrier layer to finish the production of a polyimide shadow mask. The method for producing the shadow mask by utilizing a polyimide material has small process difficulty, high precision of graphic dimensions and low manufacturing cost, and is suitable for large-area graphization process of the field of the preparation of organic semiconductor devices.

Description

technical field [0001] The invention belongs to the field of microfabrication in semiconductor science, and relates to a preparation technology of an evaporation mask for semiconductor device preparation, in particular to a method for preparing a hollow polyimide evaporation mask stencil. Background technique [0002] It is inevitable to pattern each functional material layer in the fabrication of semiconductor devices. In traditional silicon technology, photolithography is often used for pattern definition. However, in the preparation of organic semiconductor devices, due to the sensitivity of organic materials to photoresist and developer, the method of lithography to define patterns is greatly limited. Therefore, patterning using a shadow mask is widely used. The metal stencil is the most widely used at present. The thickness of the metal substrate used when making the mask stencil with metal materials is relatively large, about tens or even hundreds of microns. Large ...

AI Technical Summary

Problems solved by technology

At present, the most widely used metal stencil is the metal stencil. The metal substrate used when making the mask stencil with metal materials is relatively thick, about tens or even hundreds of microns. Large lateral corrosion brings insurmountable obstacles to the production of high-precision and high-resolution metal stencils. It is difficult to ensure precise dimensions and neat edges for stencil graphics

In addition, metal stencil production takes a long time and is expensive, which is not suitable for research and production

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