Fluorescent powder performed thin film-based LED lamp and manufacturing method thereof

A technology for LED lighting and phosphors, applied in lighting devices, lighting and heating equipment, chemical instruments and methods, etc., can solve the problems of different light chromaticity, decreased luminous efficiency of phosphors, affecting LED life, etc. High degree of consistency and adjustability, convenience in size and phosphor content, and reduction in production processes and materials

Inactive Publication Date: 2009-11-04
NANJING TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned LED packaging process, there are several key problems: first, it is difficult to keep the concentration of the phosphor powder consistent from beginning to end when dispensing glue, because the phosphor powder maintains a certain particle size in the binder, and the fluorescent powder The powder has a certain weight, and its density is much larger than that of the binder. Therefore, although the binder is relatively viscous, the phosphor will still slowly settle in it, and the time for degassing is longer, which indirectly promotes the phosphor powder. Therefore, when dispensing glue, the concentration of phosphor powder in the glue dispensed at the beginning is higher, and the concentration is lower as the glue is dispensed, which leads to different batches or even LEDs manufactured in the same batch. In the end, the factory must classify the manufactured LEDs according to parameters such as color error or color temperature; second, it is difficult to achieve consistent thickness of the glue on a single chip, because the glue dispensed by the glue dispenser is equal to each other. It is approximately spherical, so the cured phosphor coating must be thick in the middle and thin in the periphery. The light chromaticity of the finally packaged LED must be inconsistent from the middle and the periphery, yellowish in the middle and blue in the periphery; The problem of luminous attenuation caused by the current LED packaging process is to directly dispense the mixture of phosphor and binder onto the chip, and the chip will emit a lot of heat when it is working, causing the temperature around the chip to rise rapidly. As a result, the luminous efficiency of the phosphor is continuously reduced due to heat, which directly affects the life of the LED.
According to market research, the price of a 5W white LED lighting lamp composed of a single 1W LED is about 100 yuan. , the vast majority of families cannot accept it

Method used

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  • Fluorescent powder performed thin film-based LED lamp and manufacturing method thereof

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Embodiment 1

[0025] Weigh 2g of YAG fluorescent powder and 5g of silica gel, mix them evenly, apply a layer of 0.2mm thick film by screen printing method, put it in a vacuum dryer and heat and cure at 150°C for 30 minutes, take out the film and cut it into 20cm according to production requirements ×40cm film, apply a little silica gel on one side of the light-transmitting lens, then paste the cut film on it, put it in a vacuum desiccator and heat and cure at 150°C for 30 minutes, ready to use. Fix 20 chips on the metal substrate, connect the chips and the circuit on the metal substrate with gold wires, and keep the chips in parallel, and then coat a layer of silica gel on the metal substrate, so that the silica gel can connect the chips, gold The wire and the metal substrate are completely covered, and then the whole is put into a vacuum desiccator and solidified at 120°C for 1 hour. After cooling, the metal substrate is fixed in the lampshade, and then the light-transmitting lens with the ...

Embodiment 2

[0027] Weigh 5gYAG phosphor powder, 10gLiEuW 2 o 8 Phosphor powder and 20g epoxy resin, mix them evenly, apply a layer of 0.2mm thick film by screen printing method, put it into a vacuum dryer and heat and cure at 110°C for 30 minutes, take out the film and cut it into a certain size according to the production requirements Apply a little epoxy resin on one side of the light-transmitting mirror, then paste the cut film on it, put it in a vacuum desiccator and heat and cure it at 150°C for 20 minutes, and set it aside. Fix 50 chips on the metal substrate, connect the chips and the circuit on the metal substrate, and keep the chips in parallel, and then coat a layer of epoxy resin on the metal substrate, let the epoxy resin connect the chips, The gold wire and the metal substrate are completely covered, and then the whole is put into a vacuum desiccator and solidified at 100°C for 1 hour. After cooling, fix the metal substrate in the lampshade, and then install the light-transm...

Embodiment 3

[0029] Weigh 20gYAG phosphor powder, 10gSr 2 Si 2 N 8 :Eu 2+Fluorescent powder, 40g of silica gel, mix it evenly, apply a layer of 0.3mm thick film by screen printing method, put it in a vacuum dryer and heat and cure at 120°C for 60 minutes, take out the film and cut it into a film of a certain size according to the production requirements film, apply a little silica gel on one side of the light-transmitting mirror, and then paste the cut film on it, put it in a vacuum desiccator and heat and cure at 120°C for 30 minutes, ready to use. Fix 100 chips on the metal substrate, connect the chips and the circuit on the metal substrate, and keep the chips in parallel, and then coat a layer of silica gel on the metal substrate, so that the silica gel can connect the chips, gold wires, metal The substrate is completely covered, and then the whole is put into a vacuum desiccator and cured at 150°C for 1 hour. After cooling, fix the metal substrate in the lampshade, and then install ...

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Abstract

The invention relates to a fluorescent powder performed thin film-based LED lamp and a manufacturing method thereof. The LED lamp consists of a metal substrate 1, a chip 2, a gold wire 3, a binder layer 4, a fluorescent powder performed thin film layer 5, a light transmitting lens 6, a lamp shade 7 having an inner wall which is a reflector, wherein the chip 2 is fixed on the metal substrate 1; the gold wire 3 is first well connected with a circuit between the chip 2 and the metal substrate 1; an integration formed by the chip 2, the gold wire 3 and the metal substrate 1 is coated with a layer of the binder 4 to cover the metal substrate 1, the chip 2 and the gold wire 3 completely; the integration is arranged in the lamp shade 7 having the inner wall which is the reflector; the light transmitting lens 6 is arranged on the light-emitting side of the metal substrate; and the fluorescent powder performed thin film layer 5 is bonded on the inner side of the light transmitting lens 6. The LED lamp manufactured by using the packaging structure can simplify production process, improve production efficiency and greatly reduce cost and has high consistency and uniformity in various light-emitting performances.

Description

technical field [0001] The design of the invention relates to an LED lighting lamp based on a fluorescent powder prefabricated film and a manufacturing method thereof, belonging to the field of solid lighting. Background technique [0002] As a new type of solid light source, LED (Light Emitting Diode) develops rapidly because of its small size, fast response, good shock resistance, long life, especially energy saving and environmental protection. In recent years, it has been widely used in large-screen display, traffic signal lights, landscape lighting, street lighting and other fields. However, due to some difficulties that have not been overcome, it has not yet entered the general lighting fields such as home lighting and office lighting. [0003] Due to technological development, the current mainstream LED manufacturing method is blue light chip + yellow phosphor powder. The specific process is: first fix the chip on the bracket, connect the circuit; then weigh the phosp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V5/04F21V7/00F21V9/10C09K11/08H01L33/00F21Y101/02F21K9/00F21V9/40F21Y115/10
Inventor 王海波张瑞西
Owner NANJING TECH UNIV
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