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Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion

A technology of resin composition and thermoplastic resin, which is applied in heat exchange equipment, electric solid-state devices, semiconductor devices, etc., can solve the problems of LED components such as short life, brightness reduction, and temperature rise, and achieve excellent mechanical strength and reflection characteristics Excellent, temperature rise suppression effect

Inactive Publication Date: 2012-04-11
TECHNO POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the LED element emits heat when it emits light, in this type of LED lighting device, the temperature rise of the LED element when it emits light leads to a decrease in luminance, shortening the life of the LED element, etc.

Method used

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  • Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion
  • Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion
  • Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion

Examples

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Embodiment

[0119] The following examples are given to illustrate the present invention in more detail. The present invention is not limited to the examples, as long as it does not exceed the gist of the present invention. In addition, in the following, parts and % are based on mass unless otherwise specified.

[0120] 1. Production and evaluation of heat-dissipating resin composition Raw material components of compositions used in the following examples and comparative examples are shown. 1-1. Thermoplastic resin (1) A1: Copolymerized polybutylene terephthalate (modified PBT endowed with flexibility; dimethyl terephthalate, 1,4-butylene glycol, and polytetramethylene Copolymer of methyl glycol) "NOVADURAN 5505S" (trade name) manufactured by Mitsubishi Engineering-Plastics was used. The glass transition temperature is 27°C. (2) A2: "NOVADURAN 5007" (trade name) manufactured by Mitsubishi Engineering-Plastics Corporation was used for the homopolymerization type polybutylene terephthalate....

Embodiment 25

[0142] Example 25 The pellets formed of the heat-dissipating resin composition of Example 1 were melted at 260° C., and the melt was injected into a mold (mold temperature: 50 to 80° C.) formed with Shaped through-holes are used to insert electrodes connected to LED elements on the expanded inner wall, and the mold has a rectangular cavity space such as a circular recess formed from the central part to the end side, thereby obtaining image 3 The shown LED mounting substrate 11b (about 10 mm in length, about 4 mm in width, and about 2 mm in maximum height of the reflector portion) has a reflector portion.

Embodiment 26

[0143] In Example 26, instead of the heat-dissipating resin composition of Example 1, the heat-dissipating resin composition of Example 18 was used, except that it was performed in the same manner as in Example 24 to obtain figure 2 The LED mounting substrate 11a is shown.

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Abstract

The purpose of the invention is to provide a heat-dissipating resin composition which is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting, and excellent in heat dissipation, electrical insulation, heat resistance and light resistance during the time when an LED element emits light. Also disclosed are a substrate for LED mounting and a reflector respectively containing such a heat-dissipating resin composition. Specifically disclosed is a composition containing a thermoplastic resin such as a modified PBT and a thermally conductive filler such as a flake boron nitride. The composition has a heat distortion temperature of not less than 120 DEG C, a thermal conductivity of not less than 2.0 W / (m K) and a thermal emissivity of not less than 0.7.

Description

technical field [0001] The present invention relates to a heat-dissipating resin composition and a molded article containing the composition, and more specifically, to an LED mounting substrate constituting a surface mount type LED package (LED package) and an LED mounting substrate disposed on the LED mounting substrate. The heat-dissipating resin composition applicable to the formation of the reflector and each of the above-mentioned articles. Background technique [0002] Conventionally, LED elements have been used as light sources such as display lamps because of their small size, long life, and excellent power saving properties. In addition, in recent years, since LED elements with higher luminance can be manufactured at a lower cost, their use as a substitute light source for fluorescent lamps and incandescent bulbs has been studied. When used in such a light source, in order to obtain a large illuminance, it is often used to arrange two or more LED elements on a surf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/00C08K3/00H01L33/00H01L33/32H01L33/56H01L33/58H01L33/60H01L33/62H01L33/64
CPCC08L101/12H05K1/0373H01L33/644F28F21/06H01L33/56H01L33/641H01L2924/0002H01L2924/00
Inventor 藤冈真佑北田房充
Owner TECHNO POLYMER CO LTD
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