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Method for reducing Al corrosion in Al pad etching technology and corresponding Al pad etching method

A technology of aluminum pads and processes, applied in chemical instruments and methods, cleaning methods and utensils, etc., to avoid corrosion and increase the number of times of use

Inactive Publication Date: 2009-12-02
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for etching an aluminum pad to improve the existing etching process for an aluminum pad to prevent corrosion of aluminum in the process

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  • Method for reducing Al corrosion in Al pad etching technology and corresponding Al pad etching method
  • Method for reducing Al corrosion in Al pad etching technology and corresponding Al pad etching method
  • Method for reducing Al corrosion in Al pad etching technology and corresponding Al pad etching method

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Embodiment Construction

[0020] In order to make the purpose and features of the present invention more comprehensible, the specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings.

[0021] Please refer to figure 1 , which is a schematic cross-sectional view of an aluminum pad stack provided by an embodiment of the present invention. As shown in the figure, the aluminum pad stack includes an exposed photoresist layer 100 , a first barrier layer 200 , an aluminum pad layer 300 , a second barrier layer 400 and an anti-reflection layer 500 . Wherein the first barrier layer 200 and the second barrier layer 400 are usually titanium nitride (TiN) layer and tantalum nitride (TaN) layer, and the anti-reflection layer 500 is a SiON layer; Commonly used dimensions; no more details here, just take this as an example to illustrate the essential features.

[0022] Please refer to figure 2 and image 3 , which are respectively a sch...

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Abstract

The invention discloses a method for reducing Al corrosion in an Al pad etching technology and a corresponding Al pad etching method. After an Al pad laminated layer is etched by a dry method and photoresist is removed, residues generated in the process of etching are removed by the mixing plasma airflow of oxygen and nitrogen, thus, the surface of an Al pad forms a compact oxide layer, thereby preventing Al corrosion in later wet etching. In addition, the use frequency of water vapor in a step of plasma etching is increased in the process of removing the photoresist, and a polymer generated in the process of etching is also removed when the photoresist is removed.

Description

technical field [0001] The invention relates to an aluminum pad etching method, in particular to a method for reducing aluminum corrosion in the aluminum pad etching process. Background technique [0002] The dry etching of the aluminum pad is often realized by chlorine gas (Cl2), that is, the reaction of chlorine gas and aluminum (Al) is used to generate aluminum chloride (AlyClx), which is then removed by a vacuum air pump. However, there will always be some residue, and the chemical nature of AlyClx is very reactive, and it is easy to react with water in the air to form aluminum polymers. Too much polymer often leads to failure of electromagnetic compatibility (EM) tests. [0003] Therefore, the prior art uses nitrogen (N2) flow to achieve residue (Al y Cl x and polymer) removal, although it can remove residues well, it often causes aluminum corrosion in the subsequent wet etching cleaning process. Therefore, how to improve the aluminum pad etching process to prevent t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00C23F1/12
Inventor 周鸣王新鹏
Owner SEMICON MFG INT (SHANGHAI) CORP