Automatic wet process lamination method of rigid printed circuit boards

A printed circuit board and wet film laminating technology, which is applied in the secondary treatment of printed circuits, coating of non-metallic protective layers, etc., can solve problems such as graphic defects, copper surface oxidation, etc., achieve circuit integrity, protect copper surface, and save production cost effect

Active Publication Date: 2009-12-16
PANYU NANSHA YAN TIN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its disadvantage is that the residual water remains between the dry film and the copper foil. If it is parked for a long time (such as more than 8 hours), it is easy to oxidize the copper surface and cause pattern defects.

Method used

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  • Automatic wet process lamination method of rigid printed circuit boards
  • Automatic wet process lamination method of rigid printed circuit boards
  • Automatic wet process lamination method of rigid printed circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The steps of the automatic wet film laminating process for printed circuit boards are as follows:

[0020] a. Accurately weigh 100 grams of water and 1.5 grams of MEK butanone, mix and heat to 55°C;

[0021] b. Mechanically brush and chemically roughen the base material of the rigid circuit board. After drying, preheat it with a preheating machine at a preheating temperature of 50°C;

[0022] c. Add the prepared mixture to the sponge roller, and pass the pre-treated substrate through two pairs of sponge rollers, and evenly coat a layer of liquid film on the copper surface;

[0023] d. After the substrate coated with water film passes through an automatic film laminating machine with a temperature of 100°C, a pressure of 4KG, and a film laminating speed of 3m / min, the dry film is tightly attached to the copper surface substrate.

Embodiment 2

[0025] a. Accurately weigh 100 grams of water and 0.1 gram of carboxybenzotriazole, mix and heat to 50°C;

[0026] b. Mechanically brush and chemically roughen the base material of the rigid circuit board. After drying, preheat it with a preheating machine at a preheating temperature of 50°C;

[0027] c. Add the prepared mixture to the sponge roller, and pass the pre-treated substrate through two pairs of sponge rollers, and evenly coat a layer of liquid film on the copper surface;

[0028] d. Pass the substrate coated with the water film through an automatic film laminating machine with a temperature of 100°C, a pressure of 3.5KG, and a film laminating speed of 1.5m / min, and then the dry film is tightly attached to the copper surface substrate.

Embodiment 3

[0030] a. Accurately weigh 100 grams of water and 0.5 grams of 2-ethylhexanol, mix and heat to 55°C;

[0031] b. Mechanically brush and chemically roughen the base material of the rigid circuit board. After drying, preheat it with a preheating machine at a preheating temperature of 50°C;

[0032] c. Add the prepared mixture to the sponge roller, and pass the pre-treated substrate through two pairs of sponge rollers, and evenly coat a layer of liquid film on the copper surface;

[0033] d. Pass the substrate coated with the water film through an automatic film laminating machine with a temperature of 80°C, a pressure of 4KG, and a film lamination speed of 2m / min, and then attach the dry film tightly to the copper surface substrate.

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PUM

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Abstract

The invention discloses an automatic wet process lamination method of rigid printed circuit boards, comprising the following steps: adding 0.01-1.5% of surface active agent to water; then coating the mixture evenly on the surface of copper to form liquid membrane. The added surface active agent is butanone MEK, carboxyl benzotriazole, citric acid or alcohol antioxidant; with the method of the invention adopted to laminate the rigid printed circuit boards, surface oxidization of copper foil can be effectively prevented and copper surface can be protected; compared with the traditional wet process lamination method, the method of the invention strengthens liquidity of dry film and can better fill scratches and sink marks on the copper surface, thus strengthening binding force of the dry film and the copper surface and improving first pass yield of imaging transfer.

Description

technical field [0001] The invention relates to an automatic wet film pasting method for a printed circuit board, in particular to an automatic wet film pasting method for a rigid printed circuit board. Background technique [0002] A printed circuit board is an insulating board with a printed circuit, including an insulating substrate and a printed circuit. According to its type, the printed circuit board has three types: rigid, flexible and rigid-flexible; according to the number of layers, there are single-sided, double-sided and Multi-layer boards, among which rigid boards include: backplanes, HDI boards, BGA and IC packaging substrates, etc. No matter what kind of boards, copper foil is required to print and etch circuits on the substrates. The width of the existing lines is getting thinner and thinner, and the requirements for the pattern transfer process are getting higher and higher. Especially for HDI boards with blind buried holes, due to the blind buried holes san...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
Inventor 叶飙李兆辉
Owner PANYU NANSHA YAN TIN CHEM
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