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Polyimide film preparation method

A technology of polyimide film and polyamic acid, which is applied in the field of preparation of polyimide film, can solve the problems that the solid state film cannot be easily obtained, and the polyimide film cannot be obtained, so as to achieve the effect of good release effect

Active Publication Date: 2010-01-06
常熟市方舟绝缘材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the shortcoming that the solid state film of the preparation method of the polyimide film of the prior art cannot be easily peeled off from the base material, resulting in the inability to obtain a complete polyimide film, and to provide a solid state film that can be easily bonded to the base material The preparation method of the polyimide film that can obtain complete polyimide film by peeling off material

Method used

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preparation example Construction

[0008] According to the preparation method of the polyimide film provided by the present invention, although the purpose of the present invention can be realized as long as the release agent is pre-mixed in the polyamic acid solution, it has nothing to do with the type and amount of the release agent, for example The release agent can be an alkyl grease in the prior art, and the alkyl grease can be one of dimethyl silicone oil, ethyl silicone oil, phenyl silicone oil, methyl vinyl silicone oil and ethyl hydrogen silicone oil species or several. But preferably, the release agent is a phthalic acid ester having a structure shown in the following structural formula (I):

[0009]

[0010] where R 1 , R 2 , R 3 and R 4 It can be one or more of H, alkyl with 1-6 carbon atoms, alkoxy with 1-6 carbon atoms, nitro, amino and halogen, R 5 and R 6 Each can be an alkyl group with 1-16 carbon atoms, and n can be an integer of 0-5. The halogen may be fluorine, chlorine, bromine or...

Embodiment 1

[0043] This embodiment is used to illustrate the preparation method of the polyimide film provided by the present invention.

[0044] Under stirring conditions, 2.60 kg of 4,4'-diaminodiphenyl ether (ODA, Jiangsu Changshu Huishun Chemical Co., Ltd.) was dissolved in 45 liters of solvent N, N'-dimethylacetamide (DMAc, Korea Samsung Fine Chemical Co., Ltd. company), add 2.821 kg of pyromellitic dianhydride (PMDA, Jiangsu Liyang Longsha Chemical Co., Ltd.) in 4 times at 0°C and under stirring conditions, each time adding 2.26 kg, 0.42 kg, 113 g and 28 gram. After the feeding was completed, the reaction temperature was continued to be controlled at 0° C., and the reaction was continued for 12 hours to obtain a polyamic acid solution with a solid content of 12% by weight and a viscosity of 40,000 cp at 25° C.

[0045] Above-mentioned polyamic acid solution is mixed with release agent dioctyl phthalate (DOP, Tianjin Chemical Reagent No. 6 Plant No. 3 Branch Factory) to obtain the p...

Embodiment 2

[0057] This embodiment is used to illustrate the preparation method of the polyimide film provided by the present invention.

[0058] Prepare polyimide film according to the method for embodiment 1, difference is, release agent is the mixed release agent of dibutyl phthalate and dioctyl phthalate (dibutyl phthalate and The weight ratio of dioctyl phthalate is 2:1) to obtain polyimide film sample S2.

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Abstract

The invention provides a polyimide film preparation method, comprising the following steps: coating polyamic acid solution on a substrate, heating the substrate to remove the solvent of the polyamic acid solution and obtaining a solid film through peeling and performing imidization to the solid film; wherein, the polyamic acid solution comprises polyamic acid, solvent and release agent. Because the release agent is mixed in the polyamic acid solution in advance, the polyimide film preparation method of the invention has good de-filming effect and the solid film can be easily separated from the substrate so that complete polyimide film can be obtained and the polyimide film performance can not be affected.

Description

technical field [0001] The invention relates to a preparation method of a polyimide film. Background technique [0002] Polyimide is a kind of high-performance polymer material with imide ring structure characteristics, and its mechanical properties, electrical properties, and radiation resistance are excellent, which is particularly obvious during the heating process. Polyimide film is currently the organic film with the best heat resistance, and its long-term use temperature is as high as 300°C. Its various products such as films, adhesives, coatings, laminates and plastics are widely used in aviation, aerospace, electrical, mechanical, chemical, microelectronics and other fields. [0003] The preparation methods of polyimide film mainly include thermal cyclization and chemical cyclization. At present, the thermal cyclization method is widely used. The thermal cyclization method is usually polycondensation of aromatic tetracarboxylic dianhydride and aromatic diamine in a...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K5/12
Inventor 李小花付寅江林
Owner 常熟市方舟绝缘材料有限责任公司