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Low-melting-point neutral nuisanceless glass for electronic paste and preparation method thereof

A technology of electronic paste and low melting point, which is applied in the field of glass for electronic paste and its preparation, can solve the problems of electrodes (conductor function failure, substrate surface corrosion, substrate surface blackening, etc.), and achieve excellent chemical stability and low softening temperature , low cost effect

Inactive Publication Date: 2010-01-13
SINO PLATINUM METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If there are many acidic oxides in the glass, they will react with the amphoteric substances in the slurry during sintering, causing corrosion and pulverization on the surface of the substrate; if there are many alkaline oxides in the glass, it will cause The surface of the substrate becomes black, the function of the electrode (conductor) fails, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Mix the ingredients according to the composition ratio in Table 1 and mix them evenly, put them into a porcelain crucible; put them into a box-type resistance furnace, heat up to 1150 ° C, keep warm for 30 minutes to melt, pour the melted glass liquid into cold water, and water quench; The water-quenched glass is put into a ball mill jar (the ball-to-material ratio is 2.5:1) at a speed of 50 rpm, ball milled for 72 hours, dried at 70°C, sieved to obtain an average particle size of <4 μm, and bagged for later use.

[0036] Table 1 Glass composition

[0037] Element

[0038] The present invention is prepared according to the above examples. The softening temperature of the obtained glass is 380° C., the pH is neutral, and there is no pollution. It is suitable for electronic pastes sintered at medium and low temperatures.

Embodiment 2

[0040] Mix the ingredients according to the composition ratio in Table 2, put them into a porcelain crucible; put them into a box-type resistance furnace, heat up to 1175°C, keep warm for 30 minutes to melt, pour the melted glass into cold water, and quench it; The water-quenched glass was put into a ball mill jar (ball-to-material ratio: 2.5:1), ball milled at a speed of 50 rpm for 72 hours, dried at 70°C, sieved to obtain an average particle size of <4 μm, and bagged for later use.

[0041] Table 2 Glass composition

[0042] Element

[0043] B 2 o 3

[0044] The present invention is prepared according to the above examples. The softening temperature of the obtained glass is 400° C., the pH is neutral, and there is no pollution. It is suitable for electronic pastes sintered at medium and low temperatures.

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Abstract

The invention discloses low-melting-point neutral nuisanceless glass for electronic paste and a preparation method thereof. The glass comprises 10-30 mol% of SiO2, 30-76 mol% of Bi2O3, 1-5 mol% of Al2O3, 1-6 mol% of ZnO, 2-6 mol% of MgO, 1-3 mol% of Na2O, 2-12 mol% of B2O3 and 1-3 mol% of V2O5. The low-melting-point neutral nuisanceless glass powder for electronic paste is characterized in that the softening temperature is 380-450 DEG C; the neutral low-melting-point nuisanceless glass is obtained by melting according to the calculation of the ingredients of the acidic oxide and the basic oxide in the glass; and the glass has good chemical stability when sintered under the acidic or basic atmosphere, does not contain toxic and harmful elements, such as Pb, Cd, Tl, Te, As, Cr, Sb, Hg, Co and the like which are forbidden by the environment requirements,, and is widely used for the bonding phase in the electronic paste.

Description

technical field [0001] The invention relates to glass for electronic paste and a preparation method thereof, in particular to a low melting point neutral pollution-free glass powder for electronic paste and a preparation method thereof. Background technique [0002] Low-melting glass is widely used as a binder phase in electronic pastes. The conductive paste and resistance paste of electronic paste usually contain 5-30wt% low-melting glass as the bonding phase during sintering, and electronic paste is widely used in conductors, resistors, switches, Capacitors, sensors, displays, heaters, defrosters, automotive electronics, low temperature co-fired ceramics, etc. At present, the low-melting point glasses widely used in our country contain a large amount of toxic and harmful elements prohibited by environmental requirements such as Pb, Cd, Tl, Te, As, Cr, Sb, Hg, Co, etc. Environmental and human hazards, so pollution-free is a legal requirement for the development of the ele...

Claims

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Application Information

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IPC IPC(8): C03C12/00C03C8/24
Inventor 赵玲熊庆丰张红斌
Owner SINO PLATINUM METALS CO LTD
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