Nano conductive adhesive and preparation method thereof

A nano-conductive and conductive adhesive technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of complex reaction conditions, low output, long reaction time, etc., and achieve simple preparation, uniform particle size, and conductive good effect

Inactive Publication Date: 2010-01-20
漳立冰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These techniques have complex reaction conditions, long reaction time (generally need several hours to several days), and shortcomings such as low yield (milligram level)
These tech

Method used

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  • Nano conductive adhesive and preparation method thereof
  • Nano conductive adhesive and preparation method thereof
  • Nano conductive adhesive and preparation method thereof

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preparation example Construction

[0051] The present invention also provides a preparation method of the above-mentioned nano-conductive adhesive. The preparation method is to control the reaction conditions through a microwave method to selectively prepare micron-sized, sub-micron-sized and nano-sized conductive particles. Mix silver powders and wires of different sizes in a specific particle size range and ratio to obtain an optimal compact packing. The above-mentioned conductive particles and polymer materials are mixed according to a predetermined ratio through a mixer, and a conductive adhesive with high conductivity and high rheology can be prepared.

[0052] The preparation of the present invention is divided into two steps:

[0053] (1) Prepare silver conductive particles by microwave heating.

[0054] (2) Select specific micron to nanometer-scale silver powder and silver wire particle size and proportion, and mix the above-mentioned conductive particles with polymer materials, solvents, curing agents...

Embodiment 1

[0110] The above-mentioned conductive particles of silver prepared by microwave heating are mixed in the following proportions:

[0111] Micron silver powder (A): submicron silver powder (B): nano silver powder (C): nano silver wire (D) = 30:6:1:1; then mixed with epoxy resin, solvent, curing agent, etc. to obtain conductive Glue, the mass ratio of each substance is:

[0112] Mixed conductive particles: 70%

[0113] Epoxy: 25%

[0114] Solvent: 2.5%

[0115] Curing agent: 2.5%.

[0116] The obtained conductive adhesive has more excellent conductivity than common conductive adhesives.

Embodiment 2

[0118] The above-mentioned conductive particles of silver prepared by microwave heating are mixed in the following proportions:

[0119] Micron silver powder (A): submicron silver powder (B): nano silver powder (C): nano silver wire (D) = 30:6:1:1; then mixed with epoxy resin, solvent, curing agent, etc. to obtain conductive Glue, the mass ratio of each substance is:

[0120] Mixed conductive particles: 65%

[0121] Epoxy resin: 30%

[0122] Solvent: 2%

[0123] Curing agent: 3%.

[0124] The obtained conductive adhesive has good mechanical properties in addition to excellent electrical conductivity.

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Abstract

The invention provides a nano conductive adhesive. The conductive adhesive is a uniform mixture of one of or two, three or four of micron-grade silver powder, submicron-grade silver powder, nano silver powder or a nano silver wire, and a high molecular material, solvent and a curing agent. The invention also provides a preparation method of the nano conductive adhesive, which comprises the following steps: 1. preparing the micron-grade silver powder, the submicron-grade silver powder, the nano silver powder and the nano silver wire by a microwave method; and 2. mixing the components in different proportions with the high molecular material, the solvent and the curing agent. The invention has the advantages of even diameter of a conductive silver particle obtained by the microwave method and simple preparation. The conductive adhesive performance can be improved by the optimal design of the particle proportion. The conductive adhesive with high conductive performance is prepared by three silver powder particles and one nano silver wire in certain size selection and proportion. The prepared conductive adhesive has stable performance and high rheological property.

Description

technical field [0001] The invention describes a nano-conductive adhesive and a preparation method thereof. The conductive particles are synthesized by a microwave method, and the conductive adhesive with excellent performance is obtained by selecting specific micron to nano-scale silver powder and silver wire particle sizes and proportions. Background technique [0002] The rapid development of electronic technology has put forward higher and higher requirements for the connection of electronic chips and devices. Lead-free use of green electronics has become mainstream in recent years as lead-containing solder paste materials have been banned in Europe and elsewhere. However, lead-free solder paste materials require high-temperature reflow (reflow) at 250-260°C, which consumes a lot of energy; conductive adhesives can be cured at lower temperatures, so they are widely used in many fields, such as conductive bonding of ICs, light-emitting diodes Bonding and heat conduction,...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J167/00C09J175/04C09J163/00C09J11/04B22F9/24
Inventor 漳立冰葛明圆常振宇姜清奎
Owner 漳立冰
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