Flexible seal and self-adaption recycling device for immersed photoetching machine

Abstract

The invention discloses a flexible seal and self-adaption recycling device for an immersed photoetching machine. The device is placed between a projecting lens group and a silicon wafer, comprises an injected liquid recycling component and a following disk piece and is used for restraining the boundary of an immersed liquid flow field. When liquid generates impact on the following disk piece due to the high-speed motion of the silicon wafer, the following disk piece can generate a certain offset along the direction of motion, thereby relieving the pressure of the boundary of the flow field and increasing the quantity of recycling openings to accelerate recycling; conversely, when the high-speed motion of the silicon wafer leads the pressure at one side of the flow field to be reduced, the flexible seal disk piece at the side can generate a certain offset along the direction of motion to carry out pressure compensation and reduce the quantity of the recycling openings and the liquid recycling amount at the same side. The self-adaption recycling of the liquid can be realized by adaptively the contact quantity of the recycling openings and the flow field, the recycling efficiency is effectively improved, and the vibration and the noise brought by recycling are reduced.

Description

technical field [0001] The invention relates to a flow field sealing and recovery control device in an immersion lithography (Immersion Lithography) system, in particular to a flexible sealing and self-adaptive recovery device for an immersion lithography machine. Background technique [0002] Modern lithography equipment is based on optical lithography, which uses an optical system to accurately project and expose the pattern on the mask onto a silicon wafer coated with photoresist. It includes a laser light source, an optical system, a projection mask composed of chip patterns, an alignment system and a silicon wafer coated with photosensitive photoresist. [0003] The immersion lithography system fills the gap between the projection lens and the silicon wafer with a certain liquid, and increases the numerical aperture (NA) of the projection lens by increasing the refractive index of the medium in the gap, thereby improving the resolution and focus of the lithography. dee...

AI Technical Summary

Problems solved by technology

During the high-speed movement of the substrate, once the external air or sealing liquid is involved or dissolved or diffused into the filling liquid, it will have a negative impact on the exposure quality

[0008] (3) Due to the positive pressure liquid supply and negative pressure recovery, the pressure of the two is not easy to coordinate, and it is easy to cause pressure fluctuations in the flow field to cause vibration of the components

[0009] (4) When the silicon wafer is moving at a high speed, due to the molecular cohesion, the liquid close to the silicon wafer will move with the silicon wafer, which will cause the boundary shape of the flow field to change rapidly; this change is different at different boundary positions, The commonly used pressure-equalizing air seal method cannot adaptively compensate the boundary of the flow field

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