Grinding wheel

Abstract

The invention provides a grinding wheel, which can decrease the finishing time of a grinding tool and prevent a wafer from generating crackles. The grinding wheel is arranged on a wheel seat of a grinding device in the free assemble and unassemble way, the grinding device comprises a grinding fluid supply member for supplying a grinding fluid, a main shaft driven to rotate and the wheel seat connected with the frontend of the main shaft. The grinding wheel is characterized in that the grinding wheel comprises an annular base with an internal wall, an external wall and an installation portion arranged on the wheel seat, and a plurality of grinding tools annularly arranged at the free end of the annular base, wherein a plurality of through holes which are spaced apart at prescribed intervalsare formed on the external wall of the annular base along the circumference direction, the plurality of through holes penetrate through the internal wall for discharging the grindstone dust and the grinding fluid.

Description

technical field [0001] The present invention relates to a grinding wheel of a grinding device having a plurality of grinding tools mounted on its free end. Background technique [0002] Regarding semiconductor wafers on which a large number of devices such as IC (Integrated Circuit) and LSI (LargeScale Integration: Large Scale Integration) are formed on the surface, and each device is divided by a predetermined dividing line (spacer), in After grinding the back surface to a predetermined thickness with a cutting device, cutting the planned dividing line with a cutting device, the semiconductor wafer is divided into individual devices, and the separated devices are used in electrical appliances such as mobile phones and personal computers. in the device. [0003] A grinding apparatus for grinding the back surface of a wafer includes: a chuck table holding a wafer; a grinding member rotatably supporting a grinding wheel provided with a grinding wheel for holding The wafer on...

AI Technical Summary

Problems solved by technology

Although the grinding liquid or waste liquid mixed with grinding chips flows out from between the multiple grinding tools arranged in a ring by centrifugal force, a part of it will stay inside the grinding wheel, so that the grinding tools produce There is a problem of poor production efficiency due to frequent dressing of grinding tools due to hole clogging

[0011] In addition, abrasive grains such as diamond that have come off from the grinding tool are sandwiched between the wafer and the grinding tool, and in particular, only the back surface corresponding to the device region of the wafer is ground, thereby forming a ring-shaped In the wafer of the reinforced part, there is a problem that the base of the ring-shaped reinforced part is cracked and the bending strength is lowered.

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