Hot melt adhesive

A hot-melt adhesive and melting point technology, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve the problems of weak adhesive force and inability to adapt to the needs of bonded objects, and achieve the goal of improved adhesive force Effect

Inactive Publication Date: 2010-03-03
陈铁旦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the existing EVA, EBA or the composition of EVA and EBA has weak bonding force under low temperature environment, and the b

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A hot-melt adhesive is formed by mixing the following substances in parts by mass. The following substances are melted and mixed in sequence, MI is 501g / 10mins, and 10 parts of EVA containing 26% vinyl acetate monomer; MI is 301g / 10mins. 10mins, 10 parts of EVA containing 22% vinyl acetate monomer; MI is 150g / 10mins, and 10 parts of EVA containing 18% vinyl acetate monomer; MI is 701g / 10mins, and contains 30% acrylic acid 15 parts of EBA of n-butyl ester monomer; 500g / 10mins, and 15 parts of EBA containing 25% of n-butyl acrylate monomer; at the same time, the softening point of the above-mentioned EBA and EVA is required to be 100°C; 20 parts of viscous rosin glyceride; 10 parts of microcrystalline wax with a molecular weight of 2000 and a melting point of 60°C; 10 parts of calcium carbonate with a particle size of 200-400 mesh and dried at 300-400°C for 2 hours; stabilizer 0.5 parts of 2,6-di-tert-butyl-p-cresol.

[0031] Test environment and method: the room tempera...

Embodiment 2

[0033] A hot-melt adhesive is formed by mixing the following substances in parts by mass. The following substances are melted and mixed in sequence, MI is 501g / 10mins, and 10 parts of EVA containing 26% vinyl acetate monomer; MI is 301g / 10mins. 10mins, and 10 parts of EVA containing 22% vinyl acetate monomer; MI is 150g / 10mins, and 10 parts of EVA containing 18% vinyl acetate monomer; MI is 701g / 10mins, and contains 30% acrylic acid 15 parts of EBA of butyl monomer; 500g / 10mins, 15 parts of EBA containing 25% n-butyl acrylate monomer; at the same time, the softening point of EBA and EVA is required to be 100°C; the softening point is 110°C. 20 parts of rosin glyceride; 10 parts of microcrystalline wax with a molecular weight of 2000 and a melting point of 60°C; 10 parts of calcium carbonate with a particle size of 200-400 mesh and dried at 300-400°C for 2 hours; stabilizer 2, 0.5 parts of 6-di-tert-butyl-p-cresol.

[0034] Test environment and method: the room temperature is ...

Embodiment 3

[0036] A hot-melt adhesive is formed by mixing the following substances in parts by mass. The following substances are melted and mixed in sequence, MI is 800g / 10mins, and 20 parts of EVA containing 30% vinyl acetate monomer; MI is 500g / 10mins 10mins, and contain 25% vinyl acetate monomer EVA 20 parts; MI is 300g / 10mins, and contains 21% vinyl acetate monomer EVA 20 parts; MI is 900g / 10mins, and contains 33% acrylic acid 30 parts of EBA of n-butyl ester monomer; 700g / 10mins, and 30 parts of EBA containing 28% of n-butyl acrylate monomer; at the same time, the softening point of the above-mentioned EBA and EVA is required to be 110 ° C; the softening point is 110 ° C 30 parts of viscous pentaerythritol rosin ester; 10 parts of Fischer wax with a molecular weight of 5000 and a melting point of 90°C; 15 parts of calcium carbonate with a particle size of 200-400 mesh and dried at 300-400°C for 3 hours; stable Agent 2,6-di-tert-butyl-p-cresol 1 part.

[0037] Test environment and ...

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Abstract

The invention relates to a hot melt adhesive which comprises substances based on the parts by weight: 10-20 parts of 501-800g/10mins of MI containing 26-30% of vinyl acetate monomer EVA, 10-20 parts of 301-500g/10mins of MI containing 22-25% of vinyl acetate monomer EVA, 10-20 parts of 150-300g/10mins of MI containing 18-21% of vinyl acetate monomer EVA, 15-30 parts of 701-900g/10mins of MI containing 30-33% of N-butyl acrylate monomer EBA, and 15-30 parts of 500-700g/10mins of MI containing 25-28% of N-butyl acrylate monomer EBA; meanwhile, softening point of the EBA and the EVA is 100-110 DEG C; furthermore, the hot melt adhesive also comprises 20-30 parts of tackifier which has the softening point of 100-110 DEG C and can be pentaerythritol abietate, ester gum, hydrogenated abietate, terpene-phenolic abietate, terpene-phenolic resin or gum rosin, 10-15 parts of wax having the molecular weight of 2000-5000 and the melting point of 60-90 DEG C, 10-25 parts of filler and 0.5-1 part ofstabilizing agent.

Description

technical field [0001] The invention belongs to an adhesive based on a homopolymer or a copolymer having one or more unsaturated aliphatic compounds, and particularly relates to a hot melt adhesive with high viscosity in a low temperature environment. Background technique [0002] Polyethylene vinyl acetate (abbreviated as EVA) and polyethylene n-butyl acrylate (abbreviated as EBA) hot melt adhesive is a solid meltable polymer that does not require solvents and does not contain 100% moisture; they are Solid, heated and melted to a certain temperature to become a fluid and viscous liquid. The melted EVA hot melt adhesive is light brown or white. EVA and EBA hot melt adhesives are composed of basic resins, tackifiers, viscosity modifiers and antioxidants. [0003] At present, the existing EVA, EBA or the composition of EVA and EBA has weak bonding force under low temperature environment, and the bonding strength at minus 12 degrees Celsius is: 0.5-1.5kg / 25mm, which cannot me...

Claims

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Application Information

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IPC IPC(8): C09J123/08C09J131/04C09J133/06
Inventor 陈铁旦程云环刘结平
Owner 陈铁旦
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