Method and system of micro three-dimensional structure by micro-nano electric discharge machining

A technology of electrical discharge machining and three-dimensional structure, which is applied in the direction of microstructure technology, microstructure devices, nanostructure manufacturing, etc., can solve the problems of difficult chip removal and the reduction of microstructure size, etc., and achieve the goal of solving chip removal problems and enriching technical methods Effect

Inactive Publication Date: 2010-03-10
TIANJIN UNIV
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Problems solved by technology

At the same time, because the size of the processed structure is too small, it is difficult to remove chips by using external flushing, which makes the problem of chip removal more prominent in the EDM process, thus restricting the further reduction of the size of the microstructure

Method used

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  • Method and system of micro three-dimensional structure by micro-nano electric discharge machining

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Embodiment Construction

[0020] The present invention uses nanowires and nanotubes as electrodes for nano-discharge processing to process micron and nanoscale complex three-dimensional structures, and the nanowires and nanotubes used as electrodes need to meet the following conditions:

[0021] Nanowires and nanotubes need to have good electrical and thermal conductivity and mechanical properties. For example, the melting point of carbon nanotubes is the highest among known materials at present, and it is not easy to be corroded by heat in electric discharge machining; secondly, the molecular structure of carbon nanotubes is stable and has high thermal stability; thirdly, the structure of carbon nanotubes It has the same sheet structure as graphite, so it has good electrical properties. At the same time, carbon nanotubes have high heat exchange along the tube axis, which is good for heat dissipation during processing; finally, carbon nanotubes have good mechanical properties, and their tensile strength...

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Abstract

The invention belongs to the field of micro-nano manufacturing technology, and relates to a method of a micro three-dimensional structure by micro-nano electric discharge machining, which comprises the following steps: (1) fixing a nanowire or nanatube with electrical conductivity on the point of a probe made of conductive material as an electrode; (2) placing an electrode clamping device on a displacement platform, and controlling the movement of the displacement platform by a multi-axis motion controller; (3) placing a conductive material workpiece on an X / Y precise displacement platform, and controlling the movement of the X / Y displacement platform by the multi-axis motion controller; (4) connecting the cathode of a pulse power supply to the probe, and connecting the anode thereof to the workpiece; and (5) sending a command to a multi-axis motion control card by an industrial personal computer, controlling the displacement platform placing the electrode clamping device, providing work voltage for electric discharge machining by the pulse power supply, collecting discharge gap voltage by a gap voltage detecting device, and controlling the movement of an electrode feed displacement platform by the industrial personal computer according to the gap voltage. The method leads the size of the electric discharge machining to reach micro and nano level and simultaneously solves the problem of chip removal during the machining process.

Description

technical field [0001] The invention belongs to the technical field of micro-nano manufacturing, and relates to a method and system for electric discharge machining of a micro-nano three-dimensional structure. Background technique [0002] As one of the special processing technologies, electrical discharge machining has been widely used in industry. With the miniaturization of products, the research on processing technology and methods of micro-nano three-dimensional structure has become one of the main topics in the field of manufacturing. According to different processing principles, the processing of micro-nano three-dimensional structures can be divided into two categories: traditional mechanical processing and special processing. In traditional mechanical processing, due to the existence of macroscopic cutting force, there are phenomena such as stress and heat in the processing process. In micro- and nano-scale processing, it is difficult to control the processing accu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B82B3/00B81C5/00B81C1/00B81C3/00
Inventor 房丰洲徐宗伟王庆袆胡小唐
Owner TIANJIN UNIV
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