Modified photo-hardening resin composition for high-wear-resistance/high-toughness/high-hardness nanometer materials

A technology of light-hardening resin and nanomaterials, which is applied in the treatment of dyed low-molecular-weight organic compounds, fibrous fillers, etc., to achieve the effect of saving electricity cost and material cost

Inactive Publication Date: 2011-08-31
NANTONG MEMTECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are a small number of domestic companies developing this type of material, many properties such as wear resistance, pencil hardness, flexibility, no yellowing, and chemical resistance test cannot meet the needs of mobile phone manufacturers, and this type of material is due to technical confidentiality factors. , cannot be imported from abroad

Method used

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  • Modified photo-hardening resin composition for high-wear-resistance/high-toughness/high-hardness nanometer materials
  • Modified photo-hardening resin composition for high-wear-resistance/high-toughness/high-hardness nanometer materials
  • Modified photo-hardening resin composition for high-wear-resistance/high-toughness/high-hardness nanometer materials

Examples

Experimental program
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Effect test

Embodiment 2

[0052] In the stainless steel bucket, first add prepolymers such as silane-modified polyepoxy (meth)acrylate prepolymer and urethane acrylate, then add the mixed reactive diluent, stir to dissolve, and then add the self-made silane-modified non- Photosensitive inorganic nanoparticle material, then continue to add UV photoinitiator, thermal initiator and a small amount of polymerization inhibitor, coupling agent, leveling agent, defoamer and complex metal dye, etc., and stir evenly with a high-speed mixer to obtain three System hardening resin composition, ready to use.

[0053] Silane-modified non-photosensitive inorganic nanoparticles 0.1-60% (example 1%, 30%, 60%)

[0054] Silane-modified polyepoxy (meth)acrylate prepolymer 0-50% (example 1%, 20%, 50%)

[0055] Resin prepolymer mixture 5-50% (eg 5%, 30%, 50%)

[0056] Mixed reactive monomers 10-80% (eg 15%, 50%, 80%)

[0057] Photoinitiator 0.1~10% (Example 1%, 5%, 10%)

[0058] Thermal initiator 0.1~10% (Example 1%, 5%,...

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Abstract

The invention discloses a modified photo-hardening resin composition for high-wear-resistance / high-toughness / high-hardness nanometer materials, which consists of silane-modified non-photosensitive inorganic nanometer particles, silane-modified polypropylene (methyl) oxide acrylate prepolymers, resin prepolymer mixture, mixed active monomers, a photo initiator, a thermal initiator and assistants. The resin composition has the advantages of high hardness, high wear resistance, high toughness, high yellowing resistance, high temperature and humidity resistance, wide applicability and the like.

Description

Technical field: [0001] The present invention relates to a resin composition. Background technique: [0002] The current coating type photohardening resin coating is used as the surface of the mobile phone control panel based on polyethylene terephthalate (PET) / polycarbonate (PC) / polymethyl methacrylate (PMMA) film The molding material is gradually accepted by more and more mobile phone manufacturers. Its main feature is that it can be light-cured according to the design requirements of the mobile phone control panel. It can achieve the required high wear resistance and high hardness on the surface through the adjustment of the light-hardening resin composition. Or high flexibility, good feel and other surface features, and even the surface effects of different colors can be modulated according to design needs. Although there are a small number of domestic companies developing this type of material, many properties such as wear resistance, pencil hardness, flexibility, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F291/00C08F265/04C08F283/00C08F283/06C08F283/01C08F2/48C08K9/06C09C1/28C09C1/36C09C3/08
Inventor 张劲松黄诚严晓建董亚东
Owner NANTONG MEMTECH TECH
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