Dynamic pressure cavitation jet polishing device of colloidal flow and method

Abstract

The invention discloses a dynamic pressure cavitation jet polishing device of colloidal flow and a method, relating to a polishing device and a method and aiming at solving the problems that the existing polishing method of the ultrasmooth surface has low processing efficiency and high cost, the adaptability of the work piece material is limited and the existing polishing device of the ultrasmooth surface has complex equipment and high maintenance cost. The device is characterized in that a cavitation jet device is fixed on a bracket; the input end of the cavitation jet device is connected with an outlet of a first flow reversing valve by a pipeline. The method comprises the following steps: (1) the polished work piece is immersed with 10 to 200mm by the colloidal polished liquid level; (2) the oil pressure of the cavitation jet device is 0.5 to 15MPa; (3) the cavitation jet pressure is 0.5 to 15MPa; and (4) the cavitation jet device is arranged in colloidal polishing liquid, the cavitation jet device sprays to the work piece at the speed of 15 to 250m / s, and after polishing, the work piece is taken out, namely the polished work piece. The invention is used for ultraprecise and ultrasmooth polishing of optical glass, microcrystal glass, semiconductor materials and monocrystal materials.

Description

Colloidal fluid flow pressure cavitation jet polishing device and method technical field The invention relates to a polishing device and method. Background technique With the rapid development of modern science and technology, especially cutting-edge science and technology such as aviation, aerospace, national defense, military industry, information, microelectronics and optoelectronics, modern optical systems (such as modern short-wave optics, strong light optics, etc.) and optoelectronics and thin films The scientific field has higher and higher requirements for the surface quality of the device. In order to meet its performance, the surface roughness of the device is required to be below 1nm, and the processed surface requires as small as possible surface defects and subsurface damage; such as silicon surface Minor surface roughness will affect the performance of microelectronic devices. In the next generation of ultra-large-scale integrated circuits, ultra-smooth surfa...

AI Technical Summary

Problems solved by technology

The purpose of the present invention is to solve the problems of low processing efficiency, high processing cost, limited adaptability of workpiece material and complex equipment and high maintenance cost of the existing ultra-smooth surface polishing device in the existing ultra-smooth surface polishing method, Provided is a colloidal fluid flow pressure cavitation jet polishing device and method

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