Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components

Abstract

A metal film containing Ni as a main component and Mn and at least one element selected from the group consisting of the elements of Groups 3A, to 6A of the periodic table includes a central part anda peripheral part in which Mn and the element selected from the group consisting of the elements of Groups 3A to 6A of the periodic table are present in a concentration higher in the peripheral part than that in the central part. The metal film used as a conductor layer can have an increased melting point at the peripheral part and thus can be prevented from shrinking during heating. The metal film used as a conductor layer in electronic components and the like can be prevented from plastically deforming or shrinking during heating so that the conductor layer can have a large effective area and high adhesion to ceramic layers.

Description

technical field [0001] The present invention relates to a kind of metal film and its manufacturing method, and the manufacturing method of laminated electronic component and laminated electronic component, especially relate to the metal film with Ni as main component and its manufacturing method, also this metal film is used as A method of manufacturing a multilayer electronic component to which a conductor layer is applied, and a multilayer electronic component. Background technique [0002] In recent years, multilayer ceramic capacitors, which are representative examples of multilayer electronic components, have been required to reduce the thickness of the dielectric layer as the ceramic layer and thinner the inner electrode layer as the conductor layer in response to the demand for smaller size and higher capacity. For example, as the conductive pattern of the internal electrode layer, its formation method is not only the method of forming a thin film on a thin film by a ...

AI Technical Summary

Problems solved by technology

If Ni is segregated like this 3 S 2 Metal films of intermetallic compounds such as are used as conductor patterns, then as Figure 5 As shown, the end portion of the conductor layer 55 formed inside the multilayer ceramic capacitor shrinks, and a void 59 is easily formed between the end portion and the ceramic layer 57. Therefore, there is a problem that the thermal shock resistance test cannot be performed due to the void. gain reliability

However, if an industrial large-scale production firing furnace such as a tunnel-type continuous furnace is used and a large amount of firing is performed at the same time, since the temperature difference in the furnace is large compared with the experimental furnace, the firing temperature is low. For the samples fired in the region, the shrinkage of the end of the conductor layer decreases after firing, while the shrinkage of the end of the conductor layer becomes larger for the samples fired in the region with a high firing temperature, and at the same time, the conductor layer is prone to occur. Structural defects such as layer interruptions and voids

Therefore, the effective area of ​​the conductor layer is reduced, and as a result, there is a problem that the electrostatic capacity of mass-produced multilayer ceramic capacitors decreases.

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