Process used for spray forming Si-Al alloy solid-liquid two-phase region hot working molding encapsulating parts

Abstract

The invention provides a process for spray forming 50-80 wt% of Si-Al and the micro alloyed series alloy solid-liquid two-phase region hot working molding encapsulating parts, belonging to the field of metallic material processing and molding technique and electronic encapsulating material. The Si-Al alloy work piece blank which is well-prepared by spray forming and the mould are assembled well and placed in a hot pressing furnace for heating, and heat preservation forming is carried out when the solid-liquid two-phase region is heated. The process has the following parameters: the temperature is 680-760 DEG C, the intensity of pressure is 50-200 MPa and the time for heat preservation and pressure maintaining is 5-60min. The invention has the advantages that the two process procedures of densification treatment of spray forming ingot blank and the near net molding manufacturing of Si-Al alloy encapsulating parts are completed in one step of process operation, thus realizing the low cost, short flow and near net molding manufacturing of electronic encapsulating parts while effectively eliminating tissue defect in spray forming ingot blank and improving comprehensive performance of the product simultaneously.

Description

technical field [0001] The invention belongs to the field of metal material processing and molding and electronic packaging materials, and in particular provides a process specially used for thermal processing and molding of packaging parts in the solid-liquid two-phase region of silicon-aluminum alloy material with low density, low thermal expansion coefficient and high thermal conductivity. method. Background technique [0002] Electronic packaging technology is developed along with the development of microelectronics technology. The main function of electronic packaging is to provide mechanical support for fine electronic circuits and as a conductive connection medium, which plays an indispensable role in the development of microelectronics technology. The most basic part of an electronic package (level zero) is generally considered a semiconductor chip (integrated circuit), which integrates logic gates, transistors, and gate-to-gate connections, all directly integrated o...

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Problems solved by technology

[0006] Aiming at the deficiencies in the background technology, the present invention provides a process for preparing silicon-aluminum-aluminum packaging parts by thermal processing in the solid-liquid two-phase region. In this process, the workpiece blank prepared by spray forming and the mold are placed in a hot-press furnace together. In the process, the silicon-aluminum alloy is quickly heated to the solid-liquid two-phase region and then hot-pressed, which overcomes the long processing route, low material utilization rate, and production cost that exist when the conventional process needs to be hot-pressed and densified before processing and forming packaged parts. A series of advanced problems, while effectively eliminating structural defects in the spray-formed ingot and improving the overall performance of the product, it has realized the short-process and near-final molding manufacturing of electronic packaging parts

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