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Double-platform exchange system for silicon chip platform of lithography machine and exchange method thereof

A technology for switching systems and wafer tables, which is applied to the double-swap switching system of lithography machine silicon wafer tables and its exchange field, which can solve the problems of insufficient space utilization, processing and assembly precision, etc., and improve space utilization and system efficiency , Simplify the structure of the control system and reduce the effect of installation accuracy requirements

Active Publication Date: 2011-05-11
TSINGHUA UNIV +1
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0008] The present invention aims at the deficiencies and defects existing in the double-swap exchange system of silicon wafer tables of lithography machines, and proposes a double-swap exchange system and method for silicon wafer tables of lithography machines, so as to overcome the disadvantages of the existing double-swap exchange system of silicon wafer tables. The shortcomings of centroid drive, insufficient space utilization, and extremely high processing and assembly precision requirements make it have the advantages of simple structure, high space utilization, and no collision between linear guide rails during exchange, which further improves the lithography machine. s efficiency

Method used

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  • Double-platform exchange system for silicon chip platform of lithography machine and exchange method thereof
  • Double-platform exchange system for silicon chip platform of lithography machine and exchange method thereof
  • Double-platform exchange system for silicon chip platform of lithography machine and exchange method thereof

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Embodiment Construction

[0028] Below in conjunction with accompanying drawing, structure, principle and working process of the present invention are described further

[0029] figure 2 Schematic diagram of the structure of the dual wafer stage exchange system of a lithography machine provided by the present invention, the system includes a first wafer stage 3 operating at the exposure station, a second wafer stage 8 operating at the pretreatment station, and a second wafer stage 8 operating at the pretreatment station. One X-direction linear guide rail 2, the second X-direction linear guide rail 6, the first single-degree-of-freedom auxiliary drive unit 1, the second single-degree-of-freedom auxiliary drive unit 7, the third single-degree-of-freedom auxiliary drive unit 15, and the fourth single-degree-of-freedom auxiliary drive unit Auxiliary drive unit 16, first Y-direction guide rail 4, second Y-direction guide rail 9, first wafer stage auxiliary drive unit 11, second wafer stage auxiliary drive un...

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Abstract

The invention provides a double-platform exchange system for the silicon chip platform of a lithography machine and an exchange method thereof. The system comprises two silicon chip platforms, a base platform, X-direction linear guide rails, Y-direction linear guide rails, a silicon chip platform auxiliary drive unit and four degree of freedom auxiliary drive units. The system further comprises afirst main drive unit arranged on a first X-direction linear guide rail and a second main drive unit arranged on a second X-direction linear guide rail. Under the drive of the main drive units, the Y-direction linear guide rails are capable of realizing the movement along the X direction and the rotary motion in the plane of the base platform; when the Y-direction linear guide rails drive the silicon chip platform to rotate to be parallel to the X direction, another Y-direction linear guide rail with the silicon chip platform is capable of realizing translation motion in the X direction underthe drive of the main drive units, so as to exchange the positions of the two silicon chip platforms. The invention avoids the defects of consistency of size of silicon chip platforms and extremely high precision requirements of processing and assembling parts, not only simplifies system structure, but also improves the spatial utilization rate and precision of the system.

Description

technical field [0001] The invention relates to a system for exchanging two silicon wafer tables of a lithography machine and an exchange method thereof. The system is applied to a semiconductor lithography machine and belongs to the technical field of semiconductor manufacturing equipment. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). The resolution and exposure efficiency of the lithography machine greatly affect the characteristic line width (resolution) and productivity of the integrated circuit chip. As the key system of the lithography machine, the motion accuracy and work efficiency of the silicon wafer ultra-precision motion positioning system (hereinafter referred to as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCH01L21/68G03F7/70725G03F7/70733G03F7/70758
Inventor 朱煜张鸣徐登峰汪劲松董立立胡金春尹文生杨开明段广洪马竞张利
Owner TSINGHUA UNIV
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