Green carbon dioxide supercritical fluid semiconductor cleaning equipment

Abstract

The invention discloses green carbon dioxide supercritical fluid semiconductor cleaning equipment which is used for cleaning semiconductor silicon wafers without water. The equipment comprises a main working chamber for carrying out supercritical fluid cleaning and supercritical drying, a separating chamber for separating carbon dioxide and cleaning waste liquid, a temporary storing tank for storing a cleaning agent for enhancing the cleaning effect and a cosolvent, a carbon dioxide circulation control system for compressing, cooling and storing the carbon dioxide, and the like. all parts areconnected by a pipeline with a valve. Under the cooperation of a small amount of organic solvent, the carbon dioxide without surface tension is taken as a cleaning medium and a rinsing solution to godeep into tiny holes to obtain good cleaning and drying effects. By utilizing the equipment, massive consumption of pure water and the pollution brought by chemical agents are avoided, and the problems of structure deformation, particle adsorption and the like caused by the surface tension in the traditional process are solved, and the cycle use of the carbon dioxide reduces the massive dischargeof greenhouse gases.

Description

technical field [0001] The invention relates to the technical field of anhydrous cleaning of semiconductor silicon wafers in semiconductor manufacturing technology, in particular to a carbon dioxide supercritical fluid semiconductor cleaning equipment, which uses the characteristic of no surface tension of supercritical carbon dioxide to realize anhydrous cleaning of semiconductor silicon wafers. Background technique [0002] With the advancement of microelectronics technology, the integration level of chips continues to increase, and the scale of components continues to shrink, correspondingly, the requirements for the cleanliness of silicon wafers are also getting higher and higher. Extensive cleaning is required during the manufacturing process because residual contaminants and impurities on the wafer surface can cause circuit or device structures to fail. The so-called cleaning refers to the effective removal of various types of pollution without damaging the electrical ...

AI Technical Summary

Problems solved by technology

[0006] In view of this, the main purpose of the present invention is to provide a carbon dioxide supercritical fluid semiconductor cleaning equipment, to overcome the difficulties of traditional cleaning, to solve the problems caused by traditional cleaning, such as large amount of water consumption, environmental pollution, inability to go deep into tiny pores for cleaning, and drying after cleaning. Solve problems such as structural adhesion and particle adsorption, and meet the requirements of the new generation of semiconductor technology

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