Thermal interface material

A thermal interface material and metal technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor contact, increased interface thermal resistance, large interface thermal resistance, etc., and achieve tight contact and small contact thermal resistance. , the effect of reducing thermal resistance
CN101747869AInactive Publication Date: 2010-06-23SOUTHEAST UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SOUTHEAST UNIV
Publication Date
2010-06-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a thermal interface material which comprises low-melting point metal and a carbon nanometer tube array formed by directionally arranging carbon nanometer tubes, wherein the carbon nanometer tube array is elastically bent in the low-melting point metal; a metal wetting layer is arranged at two end parts of each carbon nanometer tube; and a metal transition layer is arranged between the metal wetting layer and the low-melting point metal. In the invention, a better transitional crystal structure is formed between the metal wetting layer and each carbon nanometer tube through forming metallic carbide between the metal wetting layer and each carbon nanometer tube in a reaction manner. Compared with an interface between the metal wetting layer in a wetting state and each carbon nanometer tube, the dispersion of a phonon, an electron and other hot carriers can be further reduced, and thermal contact resistance between each carbon nanometer tube and a hot source can be further reduced. The carbide with the crystal structure has better thermal conductivity.
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Description

technical field

[0001] The invention relates to a preparation method of a microelectronic material, in particular to a thermal interface material. Background technique

[0002] When the integrated circuit chip is working in a very small space, it will generate a lot of heat. Therefore, the heat generated must be dissipated in an appropriate way to prevent the integrated circuit chip from overheating and causing operational errors and even serious problems. cause hardware circuit damage. Therefore, the heat dissipation problem in the package becomes more and more critical.

[0003] In the prior art, heat sinks are usually used to manage heat sources such as high-power components, such as chips. Therefore, the contact interface between the heat sink and the heat source becomes the heat dissipation channel of the heat source. However, since the respective surfaces of the heat source and the heat dissipation device have relatively large roughness, their actual microscopic con...

Claims

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