Manufacture method of test socket and elastic test probe used by same

Abstract

The invention provides manufacture method of a test socket and elastic test probe used by the same. The method comprises the following steps of: providing a substrate made of a nonmetal material; cladding at least one sacrificial layer on the substrate; cladding at least one photoresist layer on the sacrificial layers; carrying out an optical lithography process on the photoresist layers to remove partial photoresist layers and form a plurality of columnar protrusions; cladding a surface metal layer on the surfaces of the columnar protrusions so as to form a plurality of elastic test probes; providing a socket body provided with a plurality of openings corresponding to the plurality of elastic test probes; and removing the sacrificial layers so as to take down the test socket, wherein thetest socket is sleeved in the elastic test probes, and the elastic test probes are provided with the elastic bodies made of photoresist materials and conducting surfaces.

Description

technical field [0001] The present invention relates to a method for manufacturing a test socket for semiconductor components and the elastic test probe used therein, in particular to an elastic body made of photoresist material and then formed elastic test probes and Test sockets using this flexible test probe. Background technique [0002] In the testing of semiconductor high-frequency components, test probes or conductive connection devices with short paths are usually used to test semiconductor components. After the BGA component is packaged, the BGA component must undergo an electrical test to ensure the quality of the BGA component. However, because the packaging structure of BGA components is distributed in a high-density matrix, in order to make the test probes or conductive connection devices accurately contact the metal bumps or tin-lead bumps on the BGA components, the known conductive connection devices can be surface Adhesive matrix (surface mount matrix / SMM) ...

AI Technical Summary

Problems solved by technology

But its biggest disadvantage is that the manufacturing technology is complex and expensive. As long as one of the conductive particles A is damaged or burnt due to a short circuit caused by the test, it is impossible to directly replace a single damaged conductive particle A, resulting in the elastic conductivity of the entire ISC. Body 10 will not be able to continue to be used and scrapped, the above problems will greatly increase the cost of testing

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