PCB (Printed Circuit Board) processing method
A processing method and a technology for a resist layer, which are applied in the formation of electrical connection of printed components, electrical components, and printed circuit manufacturing, etc., can solve the problems of limited dry film sealing ability, poor dry film adhesion, and easy shovel of resin. , to achieve the effect of reducing the risk of scrapping, improving the process capacity and reducing the cost of scrapping
Active Publication Date: 2011-10-12
SHENNAN CIRCUITS
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AI Technical Summary
Problems solved by technology
[0005] 1) The sealing ability of the dry film is limited. When there are large metallized holes and grooves or side metallization, this process cannot be processed;
[0006] 2) The resin is easy to shovel, and the residual resin will cause poor adhesion of the dry film and high scrap cost;
[0007] 3) The dry film is easily scratched and the cost of scrapping is high
Method used
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[0028] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following is a detailed description in conjunction with the embodiments and accompanying drawings.
[0029] See figure 1 as well as figure 2 , The embodiment of the PCB processing method of the present invention mainly includes the following steps:
[0030] Step 101: Resin plug hole: Fill the predetermined hole on the PCB with resin;
[0031] Step 102: Shovel the resin: remove the resin remaining on the plug hole on the PCB surface;
[0032] Step 103: Pasting a dry film: Pasting a dry film on the area of the PCB surface that is not to be plugged by the resin that is scheduled to be etched as a copper-free area;
[0033] That is, stick a dry film on the PCB surface that will be etched into a copper-free area;
[0034] Step 104: setting up a resist layer: printing or plating a resist layer on the non-dry film area on the PCB surface including t...
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The invention discloses a PCB (Printed Circuit Board) processing method which comprises the following steps of: resin hole cramming: cramming preset holes on a PCB by using resin; resin leveling: shoveling resin left at the positions of the crammed holes on the surface of the PCB completely; drying film pasting: pasting a dry film on a non-resin hole cramming area preset to be etched into a copper-free area on the surface of the PCB; anti-corrosion layer arrangement: printing or plating an anti-corrosion layer on a non dry film area on the surface of the PCB, which comprises the resin hole cramming areas; film removing and etching: removing the dry film and etching on the surface of the PCB; and anti-corrosion layer removing: removing the anti-corrosion layer after etching. The invention has good adaptability to the resin hole cramming process and can greatly reduce the scrap cost.
Description
Technical field [0001] The invention relates to a processing method, in particular to a PCB processing method. Background technique [0002] The PCB industry is currently in the era of HDI high-density connection technology. The trend of line width and line spacing is becoming smaller and denser. This has led to the emergence of different types of PCB structures, such as Via on Pad, Stack Via, etc. Under this premise, the inner buried hole is usually required to be completely filled and polished to increase the wiring area of the outer layer. This process is called "plugging" in the industry. [0003] In the outer layer plugging process, the via holes of PCB boards used for packaging are required to plug oil or resin to prevent other functional hazards caused by tin hidden in the holes. Now multilayer boards are required to plug the holes with solder mask and green paint. ; Blind buried holes in the inner layer also require plug hole processing. [0004] A main process of the hol...
Claims
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IPC IPC(8): H05K3/00H05K3/42
Inventor 魏厚斌李雷罗斌秦运杰
Owner SHENNAN CIRCUITS