Device for detecting mechanical property of multifunctional film

Abstract

The invention discloses a device for detecting the mechanical property of a multifunctional film, comprising a sample stage, a loading mechanism for applying pressure on a film sample, a measuring mechanism for detecting the pressure applied on the film sample and deformation and a computer. The invention uses a digital speckle correlation method (DSCM) to measure film deformation, and combines two mechanical test methods of a bubbling method and a modified layer removal method, thus conveniently, rapidly and accurately measuring a pressure-deformation curve or a corrosion thickness-deformation curve; and mechanical properties of a film and a coating are extracted in terms of a corresponding theoretical model, thus being suitable for detecting the mechanical properties of tool films, decorative films, polymeric films and films of other types in various elastic-plastic systems.

Description

technical field [0001] The invention belongs to the technical field of photomechanics and material performance detection, in particular to a multifunctional thin film mechanical performance detection device for measuring deformation based on digital speckle correlation method. Background technique [0002] Thin film science and technology is the basis of microelectronics, information, sensors, optics, solar energy utilization and other technologies, and it has widely penetrated into various fields of contemporary science and technology. In order to meet different industrial application requirements such as high strength, wear resistance, high temperature resistance, and corrosion resistance, various surface treatment technologies such as surface coating are usually used to process the surface of the material to make it suitable for various complex working environments. Thin-film technology is also the basis of microelectronic devices and micro-electro-optic devices. Recently...

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Problems solved by technology

However, the disadvantages of the device are 1. Since the device uses plexiglass as the measurement base, and the sample is bonded on the sample holder by epoxy resin, the withstand pressure is very limited; 2. The deformation and deflection of the film is measured using He- Ne laser interferometry system has high measurement accuracy, but it has very strict requirements on the environment, and the weak noise and vibration during measurement have a great impact on the measurement results

[0013] Chinese patent CN2613756Y discloses a bubbler for testing the mechanical properties of thin films, including a sample table, a sample holder, a pressurizing pump and a pressure sensor. The pressure and deformation deflection of the film are obtained through the pressure sensor and the laser displacement sensor connected to the computer. It has the characteristics of convenient operation and flexibility, but its disadvantages are 1. Since the maximum measurement limit of the pressure sensor used is only 1MPa, the pressure range is very limited; 2. The device is loaded by a booster pump, and the speed is difficult to control during loading, which cannot be realized. Uniform loading; 3. The deflection at the center of the film is measured by an infrared laser displacement sensor with a resolution of only 2 μm and can only measure a single point. Once the center point of the film is not positioned correctly, it will cause a large error in the experimental results

Its shortcomings are: 1. Since the sample is bonded to the sample stage by bonding, the tensile strength of the adhesive is limited, and the applicable loading range is also limited accordingly; 2. The device uses a displacement sensor To measure the deformation of the film, since the displacement sensor can only measure the deformation deflection of a single point, the device uses the method of moving the sample to allow the displacement sensor to measure the contour of the film deformation. At the center point of the film, the measurement result must have a large error. On the other hand, obtaining the deformation profile of the sample by moving the sample will also make the mechanical transmission system complicated, and it is easy to introduce errors in the process of moving the sample.

[0021] The ordinary layer transfer method is to remove the entire coating to a predetermined thickness, so that the remaining part is bent, so as to measure the average residual stress in the film, but because the entire coating is removed, the removal area is large, and the operation is more complicated

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