High-temperature amorphous solder for soldering Si3N4 ceramics

A brazing filler metal and ceramic technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of low Ti activity, poor high temperature performance, high brittleness of brazing filler metal, etc., and achieve smooth surface and good plasticity Toughness, the effect of flattening on both sides

Inactive Publication Date: 2010-09-08
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Technical problem: the purpose of the invention is to solve the current problem of brazing Si 3 N 4 Ceramic Ag-Cu-Ti solder has poor high-temperature performance, Ti-Zr-Ni-Cu based solder has high brittleness and low Ti activity, and provides a brazing Si 3 N 4 High temperature amorphous solder for ceramics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Component formula: the components and contents of the brazing filler metal are as follows: Ti: 40.0%; Zr: 25%; B: 0.2%; the rest is Cu.

[0032] Preparation:

[0033] (1) After pulverizing raw materials such as electrolytic copper block (Cu), sponge titanium (Ti), sponge zirconium (Zr) and copper-boron alloy, weigh the raw materials according to the above formula on an electronic balance;

[0034] (2) Place the ingredients according to the above formula in the WK type high vacuum Ar atmosphere protection non-consumable electric arc furnace. There are 5 copper crucibles in the electric arc furnace, and a pure Ti sample is placed in one of the crucibles, and the remaining four crucibles can be Put four ingredients of the same formula or different formulas at the same time;

[0035] (3) Before smelting, vacuumize the furnace to 10 -2 Pa, after flushing the furnace with argon for 3-4 times, vacuumize to 10 -2 Pa, refill with argon to -0.06MPa;

[0036] (4) Before formal...

Embodiment 2

[0047] Component formula: the components and contents of the brazing filler metal are as follows: Ti: 35.0%; Zr: 30%; B: 0.3%; the rest is Cu.

[0048] Preparation method: same as the preparation method of Example 1.

[0049] The melting temperature range of the brazing filler metal is 1102 ~ 1130K, using the amorphous brazing filler metal to vacuum braze Si 3 N 4 The bending strength of the ceramic joint at room temperature is 184MPa; the bending strength at high temperature is 123MPa (673K).

Embodiment 3

[0051] Component formula: the components and contents of the brazing filler metal are as follows: Ti: 45.0%; Zr: 20%; B: 0.1%; the rest is Cu.

[0052] Preparation method: same as the preparation method of Example 1.

[0053] The melting temperature range of the brazing filler metal is 1109-1139K, and the amorphous brazing filler metal is used for vacuum brazing Si 3 N 4 The bending strength of the ceramic joint at room temperature is 201MPa; the bending strength at high temperature is 136MPa (673K).

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Abstract

The invention discloses high-temperature amorphous solder for soldering Si3N4 ceramics, belonging to the technical field of soldering materials. The high-temperature amorphous solder of the invention for soldering the Si3N4 ceramics comprises the following components by weight percent: 35.0% to 45.0% of Ti, 20% to 30% of Zr, 0.1% to 0.3% of B and Cu in balancing amount, wherein the melting temperature of the solder ranges from 1,100K to 1,200K, and the soldering temperature thereof is 1,223K to 1,373K. The Si3N4 ceramics is prepared by vacuum-soldering the Ti-Zr-Cu-B high-temperature active amorphous solder on the basis of the rapid solidification technology, and the maximal room-temperature strength of the Si3N4 ceramics reaches 245MPa; and the high-temperature performance thereof is much higher than that of the Ag-Cu-Ti solder and Ti-Zr-Ni-Cu solder, particularly, the high-temperature bending strength of the ceramic connector is 165.5MPa at the testing temperature of 673K.

Description

Technical field: [0001] The invention belongs to the technical field of brazing materials. involving a brazing Si 3 N 4 A high-temperature amorphous solder for ceramics, more specifically, relates to a Ti-Zr-Cu-B high-temperature active amorphous solder. Background technique: [0002] Si 3 N 4 Ceramic is a kind of promising engineering structural ceramic material, its main application fields are heat engine, wear-resistant parts and heat exchanger, etc. It is an important material for manufacturing new ceramic engines. Its research and development has aroused people's high attention. Due to the shortcomings of ceramics such as poor processability, low ductility and impact toughness, low thermal shock resistance, and difficulty in manufacturing parts with large dimensions and complex shapes, it is usually necessary to form a composite structure with metal materials for application or through the connection between ceramics To realize the manufacture of complex parts. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24
Inventor 邹家生汪成龙许祥平王超赵其章
Owner JIANGSU UNIV OF SCI & TECH
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