Device and method for measuring oxygen content in heavily-doped silicon
A technology of oxygen content and heavy doping, applied in the direction of material excitation analysis, can solve the problems of difficult calibration, expensive equipment, difficult sample preparation, etc., and achieve the effects of high sensitivity, low cost, and short measurement time.
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Embodiment 1
[0025] The sample is a 4-inch antimony-doped p-type heavily doped silicon single wafer with a resistivity of 1.7x10 -3 Ωcm, the laser breakdown spectrum test results are as follows Figure 4 As shown in middle curve 1, the area ratio of the oxygen / silicon emission peak is 0.34, and according to the relational formula measured above, the oxygen concentration It can be concluded that the oxygen content in this heavily doped silicon silicon single crystal sample is 7.3x10 16 cm -3 .
Embodiment 2
[0027] The sample is a 4-inch arsenic-doped N-type heavily doped silicon single wafer with a resistivity of 2.6x10 -3 Ωcm test results such as Figure 4 As shown in middle curve 2, the area ratio of the oxygen / silicon emission peak is 0.64, and according to the relational formula measured above, the oxygen concentration It can be concluded that the oxygen content in this heavily doped silicon silicon single crystal sample is 1.38x10 17 cm -3 .
Embodiment 3
[0029] The sample is a 4-inch boron-doped P-type heavily doped silicon single wafer with a resistivity of 1.3x10 -3 Ωcm, test results such as Figure 4 As shown in middle curve 3, the area ratio of the oxygen / silicon emission peak is 0.98, and according to the relational formula measured above, the oxygen concentration It can be concluded that the oxygen content in this heavily doped silicon silicon single crystal sample is 2.12x10 17 cm -3 .
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