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Activating solution for chemical plating and non-metallic surface activation method

An activation solution and electroless plating technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor substrate adhesion, uneven coating thickness, toxic substances, etc., to achieve smooth surface, The effect of uniform coating thickness

Inactive Publication Date: 2012-06-06
深圳市新合富力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides an activation solution for electroless plating aiming at the problems existing in the prior art, such as poor adhesion between the electroless plating layer on the surface of the non-metallic substrate and the substrate, uneven thickness of the plating layer, and easy volatilization of the activation solution to produce toxic substances. , the activation solution for electroless plating is an aqueous solution containing cuprous halide, hydrohalic acid, sodium hypophosphite and ethylene glycol, and the halogen elements in the hydrohalic acid are the same as the halogen elements of cuprous halide a halogen element; the activation solution for electroless plating also contains pyridine compounds

Method used

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  • Activating solution for chemical plating and non-metallic surface activation method

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Embodiment 1

[0031] This embodiment is used to illustrate the activation solution for electroless plating and the non-metallic surface activation method provided by the present invention. The raw materials used in the present invention are all commercially available.

[0032] (1) Preparation of activation solution: first dissolve cuprous chloride in 590mL of ethylene glycol, and add hydrochloric acid to accelerate dissolution under ultrasonic conditions; after cuprous chloride is completely dissolved, add ammonium chloride, then add sodium hypophosphite, and finally Add 2,2'-bipyridine, stir until completely dissolved, add water to make the volume to 1L, stir well and store. In the activation solution, the concentration of each component is:

[0033] Cuprous chloride: 0.404mol / L Ethylene glycol: 10.551mol / L

[0034] Hydrochloric acid: 2.093mol / L Sodium hypophosphite: 0.123mol / L

[0035] Ammonium chloride: 0.187mol / L 2,2'-bipyridine: 0.00117mol / L

[0036] (2) Substrate pretreatment: put...

Embodiment 2

[0042] This embodiment is used to illustrate the activation solution for electroless plating and the non-metallic surface activation method provided by the present invention.

[0043] Adopt the method identical with embodiment 1 to carry out surface treatment to PI film, difference is: the concentration of each component in the activation solution is:

[0044] Cuprous chloride: 0.75mol / L Ethylene glycol: 7.56mol / L

[0045] Hydrochloric acid: 2.55mol / L Sodium hypophosphite: 0.25mol / L

[0046] Ammonium chloride: 0.20mol / L 2-aminopyridine: 0.0106mol / L

[0047] After the electroless plating is completed, the surface is washed with deionized water to obtain a plated piece, which is recorded as A2.

Embodiment 3

[0049] This embodiment is used to illustrate the activation solution for electroless plating and the non-metallic surface activation method provided by the present invention.

[0050] Adopt the method identical with embodiment 1 to carry out surface treatment to PI film, difference is: the concentration of each component in the activation solution is:

[0051] Cuprous chloride: 0.29mol / L Ethylene glycol: 7.83mol / L

[0052] Hydrochloric acid: 0.8mol / L Sodium hypophosphite: 0.085mol / L

[0053] Ammonium chloride: 0.280mol / L 2,2'-bipyridine: 0.00160mol / L

[0054] After the electroless plating is completed, wash the surface with deionized water to obtain a plated piece, which is recorded as A3.

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Abstract

The invention provides activating solution for chemical plating. The activating solution for the chemical plating is aqueous solution comprising cuprous halide, haloid acid, sodium hypophosphite, ethylene glycol and pyridine compounds, wherein the halogen element in the haloid acid is the same as that in the cuprous halide. The invention also provides a method for activating the surface of a non-metallic base material by using the activating solution for the chemical plating, which comprises the step of contacting the non-metallic base material subjected to pretreatment with the activating solution provided by the invention to obtain a non-metallic base material of which the surface is provided with an active center. The activating solution for the chemical plating cannot generate toxic substances when volatilized; and after the non-metallic base material is subjected to activation and chemical plating by using the activating solution for the chemical plating, the plating layer has good adhesion to the base material, and has uniform thickness and smooth surface.

Description

【Technical field】 [0001] The invention relates to the field of non-metallic surface activation, in particular to an activation solution for electroless plating on non-metallic surfaces and a surface activation process thereof. 【Background technique】 [0002] Most non-metallic materials are non-conductors, and a conductive film must be prepared before electroplating. The commonly used method is electroless plating. Before electroless plating, surface pretreatment must be activated. The purpose of activation is to adsorb a certain amount of activation centers on the non-metallic substrate in order to induce subsequent electroless plating. Activation not only determines the quality of the electroless coating, but also determines the quality of the coating. [0003] In the early days, the activation process of electroless plating on non-metallic surfaces used precious metals. In order to reduce production costs, the research on activation solutions for electroless plating has d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/30
Inventor 韦家亮林宏业赖金洪连俊兰刘小云
Owner 深圳市新合富力科技有限公司