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Mortar cutting fluid for cutting sapphire wafers

A technology for sapphire wafers and cutting fluids, which is applied to machine tools suitable for grinding workpiece edges, polishing compositions containing abrasives, grinding machines, etc., can solve the problems of low processing costs and low equipment investment, and achieve low cutting costs. Small equipment investment, good permeability effect

Inactive Publication Date: 2010-10-27
铜陵市琨鹏光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the MWS-3020 crystal special multi-wire cutting machine adopts this method for cutting and processing. The advantage of this method is that the equipment investment is small, and the unit price is about 1.5 million yuan, and the price of the metal wire is lower than that of the diamond abrasive wire. Low, low processing cost, but this cutting method has not been applied to sapphire wafer processing

Method used

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  • Mortar cutting fluid for cutting sapphire wafers
  • Mortar cutting fluid for cutting sapphire wafers
  • Mortar cutting fluid for cutting sapphire wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Equipment used: MWS-3020 crystal multi-wire cutting machine. The main process settings are as follows:

[0013] Cutting speed: max 300~400m / min. Running speed change: acceleration and deceleration time 1s / constant speed time 6~10s. Line speed setting: 15~35m / min. Thread cutting tension setting: 28-31N on the supply side and 28-31N on the recovery side. Cutting speed: 2.0~6.0mm / h.

[0014] The cutting oil is PS-L-25 cutting oil produced by Japan PALACS, with a viscosity of 30mp at 25°C a .s. The abrasive material is diamond micropowder with a particle size of 4-12mm. The diamond micropowder is formulated into a mortar cutting fluid with cutting oil in three proportions of 4%, 12%, and 20% by weight. The main technical indicators of the cut wafers are as follows:

[0015]

[0016] All indicators meet the requirements of LED substrates.

Embodiment 2

[0018] The equipment and process parameters used are the same as above. The cutting oil is FB-10 cutting oil produced by Shenzhen Jinke Chemical Industry Co., Ltd., with a viscosity of 50mp at 25°C a .s. The abrasive material is diamond micropowder with a particle size of 4-12 μm. The diamond micropowder is formulated into a mortar cutting fluid with cutting oil in three proportions of 4%, 12%, and 20% by weight. The main technical indicators of the cut wafers are as follows:

[0019]

[0020] All indicators meet the requirements of LED substrates.

Embodiment 3

[0022] The equipment and process parameters used are the same as above. The cutting oil is Lianchuang brand crystal cutting oil produced by Suzhou Jingxie High-tech Electronic Materials Co., Ltd., with a viscosity of 20mp at 25°C a .s. The abrasive material is diamond micropowder with a particle size of 4-12 μm. The diamond micropowder is formulated into a mortar cutting fluid with cutting oil in three proportions of 4%, 12%, and 20% by weight. The main technical indicators of the cut wafers are as follows:

[0023]

[0024] All indicators meet the requirements of LED substrates.

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Abstract

The invention discloses a mortar cutting fluid for cutting sapphire wafers, which is formed by mixing a grinding material and cutting oil, wherein the grinding material is diamond micro powder of which the particle size is 4 to 12 micrometers; and the normal-temperature viscosity of the cutting oil is 20 to 50mpa.s. The diamond micro powder accounts for 4 to 20 percent of the weight of the mortar cutting fluid. The mortar cutting fluid prepared by the invention can be used on multi-line cutting machines of crystals for processing the sapphire wafers. The cutting of the sapphire wafers by using the mortar cutting fluid has the advantages of high cutting efficiency, high cutting precision, small equipment investment, small cutting loss and low cutting cost.

Description

technical field [0001] The invention relates to a mortar cutting fluid used for cutting sapphire wafers by a multi-wire cutting machine. Background technique [0002] Sapphire (α-AI203), also known as white sapphire, has good thermal conductivity, excellent electrical and dielectric properties, strong light transmission, abrasion resistance, corrosion resistance, and stable chemical properties; hardness is Damo Grade 9, second only to diamond, with a melting point of 2030°C and excellent stability at high temperatures. So it is widely used in industry, national defense, scientific research, civil and other fields. It is increasingly used as a raw material for many products such as solid-state lasers, infrared windows, semiconductor substrates, light-emitting diode (LED) substrates, precision wear-resistant bearings, 3G mobile phone panels, and high-end watch surfaces. Due to its high hardness and high brittleness, sapphire is difficult to cut into wafers, which is one of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02B24B9/16
Inventor 张学炎李林
Owner 铜陵市琨鹏光电科技有限公司
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