Semiconductor device with heat radiation and gain

Abstract

The invention relates to a semiconductor device with heat radiation and gain, comprising an integrated metal base board comprising an etching circuit, a dielectric material, a thick copper-placed crystal heat-radiation bonding pad and a plurality of electric pin bonding pads. The semiconductor device is characterized in that a chip can be directly combined with the thick copper-placed crystal heat-radiation bonding pad so that a favorable heat-radiation structure is provided when the chip is operated; and in addition, because the integrated metal base board in the semiconductor device has the dielectric material, the etching circuit can be supported to be independent of the electric pin bonding pads, the semiconductor device can improve design freedom and allow the wiring of finer circuits to strengthen coiling required when electronic assemblies are connected. Meanwhile, because the circuit is supported by the dielectric material, an anti-welding layer can be formed on the circuit to stably place welding assemblies. The invention can effectively solve the problems of poor heat radiation of the traditional packaging plastic base board, insufficient coiling capacity of a lead frame, bad electricity caused by no placement of the welding assemblies and the like.

Description

technical field [0001] The present invention relates to a semiconductor device with heat dissipation gain, especially a semiconductor device that can improve the problems of poor heat dissipation of traditional packaging plastic substrates, insufficient winding capacity of lead frames, and poor electrical performance due to no function of placing soldered components. Background technique [0002] With the continuous development of semiconductor technology, the chips carried by semiconductor devices tend to be highly integrated to provide the operation speed and functions required by electronic products. However, at the same time, the heat generated by the operation of the chips also increases relatively. In the past, lead frame packaging was generally used. Although a good heat dissipation effect can be obtained by using lead frame packaging, it does not have the ability to route fine lines. Another solution is to use a plastic substrate to obtain good winding capability, bu...

AI Technical Summary

Problems solved by technology

However, although this packaging structure can achieve the purpose of heat dissipation, it is only after the overall structure is completed in the processing process that laser blind holes need to be made and thermally conductive materials are filled to obtain this device with improved heat dissipation. While this technology wants to improve structural heat dissipation, it also has the disadvantage of spending additional costs and time for laser drilling and other processes, which is also time-consuming, labor-intensive and labor-intensive.

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