Copper foil provided with carrier

A technology of copper foil with carrier and copper foil carrier, applied in the manufacture of printed circuit precursors, printed circuit manufacturing, metal pattern materials, etc., can solve the problems of residual copper particles, poor insulation of circuit patterns, etc.

Inactive Publication Date: 2018-01-30
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even in printed wiring boards, if such an ultra-thin copper layer with a large outline (concave-convex, roughness) is used on a semiconductor package substrate required to form a particularly fine circuit pattern, undesired copper layers will remain during circuit etching. Necessary copper particles may cause problems such as poor insulation between circuit patterns

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0273] Hereinafter, the present invention will be described in more detail through examples of the present invention, but the present invention is not limited by these examples.

[0274] 1. Manufacture of copper foil with carrier

[0275]

[0276] As a copper foil carrier, a 35-micrometer-thick long electrolytic copper foil (JTC manufactured by JX Nippon Oil Metal Co., Ltd.) was prepared. The glossy surface of the copper foil was electroplated using a roll-to-roll continuous plating line under the following conditions, thereby forming 4000 μg / dm 2 The amount of Ni layer attached.

[0277] ·Ni layer

[0278] Nickel sulfate: 250~300g / L

[0279] Nickel chloride: 35~45g / L

[0280] Nickel acetate: 10~20g / L

[0281] Trisodium citrate: 15~30g / L

[0282] Gloss agent: saccharin, butynediol, etc.

[0283] Sodium lauryl sulfate: 30~100ppm

[0284] pH: 4~6

[0285] Bath temperature: 50~70℃

[0286] Current density: 3~15A / dm 2

[0287] After washing with water and pickling, 1...

Embodiment 2

[0345] After forming an ultra-thin copper layer on the copper foil carrier under the same conditions as in Example 1, the following roughening treatment 1, roughening treatment 2, antirust treatment, chromate treatment, and silane coupling treatment were performed in sequence. In addition, the thickness of the ultra-thin copper foil was set to 3 μm.

[0346] ·Coarsening treatment 1

[0347] Liquid composition: copper 10-20g / L, sulfuric acid 50-100g / L

[0348] Liquid temperature: 25~50℃

[0349] Current density: 1~58A / dm 2

[0350] Coulomb quantity: 4~81As / dm 2

[0351] ·Coarsening 2

[0352] Liquid composition: copper 10~20g / L, nickel 5~15g / L, cobalt 5~15g / L

[0353] pH: 2~3

[0354] Liquid temperature: 30~50℃

[0355] Current density: 24~50A / dm 2

[0356] Coulomb quantity: 34~48As / dm 2

[0357] ·Anti-rust treatment

[0358] Liquid composition: nickel 5~20g / L, cobalt 1~8g / L

[0359] pH: 2~3

[0360] Liquid temperature: 40~60℃

[0361] Current density: 5~20A / dm ...

Embodiment 3

[0372] After forming an ultra-thin copper layer on the copper foil carrier under the same conditions as in Example 1, the following roughening treatment 1, roughening treatment 2, anti-rust treatment, and chromate treatment were sequentially performed on the surface of the ultra-thin copper layer. treatment, and silane coupling treatment. In addition, the thickness of the ultra-thin copper foil was set to 3 μm.

[0373] ·Coarsening treatment 1

[0374] (liquid composition 1)

[0375] Cu: 10~30g / L

[0376] h 2 SO 4 : 10~150g / L

[0377] As: 0~200mg / L

[0378] (plating condition 1)

[0379] Temperature: 30~70℃

[0380] Current density: 25~110A / dm 2

[0381] Coarse Coulomb quantity: 50~500As / dm 2

[0382] Plating time: 0.5 to 20 seconds

[0383] ·Coarsening 2

[0384] (liquid composition 2)

[0385] Cu: 20~80g / L

[0386] h 2 SO 4 : 50~200g / L

[0387] (plating condition 2)

[0388] Temperature: 30~70℃

[0389] Current density: 5~50A / dm 2

[0390] Coarse Coulo...

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Abstract

Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper layer layered onto the release layer; wherein the very thin copper layer has been roughened and the Rz of the very thin copper layer surface is 1.6 [mu]m or less asmeasured with a non-contact roughness meter.

Description

[0001] This application is a divisional application of the Chinese invention patent application with the Chinese patent application number 201380046519.7, the invention name is "copper foil with carrier", and the filing date is September 11, 2013. technical field [0002] The invention relates to a copper foil with a carrier. More specifically, this invention relates to the copper foil with a carrier used as the material of a printed wiring board. Background technique [0003] A printed wiring board is usually produced through a process of forming a conductive pattern on the copper foil surface by etching after bonding an insulating substrate and copper foil to form a copper-clad laminate. With the increasing demand for miniaturization and high performance of electronic equipment in recent years, high-density packaging of mounted components and high-frequency signals are promoted, and the miniaturization of conductor patterns (narrow pitch) is required for printed wiring boa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D7/06H05K1/09
CPCC25D1/04H05K3/025H05K3/384H05K1/09
Inventor 古曳伦也永浦友太坂口和彦千叶徹
Owner JX NIPPON MINING & METALS CORP
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