Dammann grating-based femtosecond laser parallel micromachining device with real-time monitoring function

Abstract

The invention relates to a dammann grating-based femtosecond laser parallel micromachining device with a real-time monitoring function. The device is characterized in that femtosecond laser parallel micromachining is performed on the basis of the beam splitting characteristic of the dammann grating, thus greatly increasing the efficiency of femtosecond laser machining; and a CCD detector is utilized to observe and monitor the machining process in real time. The invention has good application prospect in the aspect of femtosecond laser parallel micromachining.

Description

technical field [0001] The invention relates to femtosecond pulse laser micromachining, in particular to a femtosecond pulse laser parallel micromachining device with real-time monitoring. Background technique [0002] Femtosecond pulsed laser has femtosecond pulse duration, extremely high peak power and power density, so it has unique advantages such as extremely short action time in material microprocessing, and can induce various nonlinear effects. Since the femtosecond laser began to be used in material processing in 1995, it has attracted widespread attention due to its unique processing advantages. Femtosecond laser can process almost all materials such as metals, semiconductors and dielectrics. The characteristics of ultrashort pulse, high peak power and extremely small thermal effect area of ​​femtosecond laser make the indirect damage to the material processing surface small and the processing accuracy is high. , can be used to process and make metal mask plates, e...

AI Technical Summary

Problems solved by technology

[0003] At present, the common femtosecond laser micromachining generally uses a single beam of laser to focus and then scan in a single way, the processing speed is slow and the efficiency is low

In order to improve efficiency, parallel processing is generally adopted. One parallel processing method is realized by beam splitters obtained by coating, but beam splitters generally can only achieve 1×2 beam splitting. To achieve multi-channel beam splitting, it is required Cascade, which brings the complexity of the optical path; another parallel processing method is to use the microlens array to achieve multiple focused beams for parallel micromachining, but there are also some shortcomings in the use of the microlens array. If the manufacturing cost is relatively high, the uniformity of the light source is required to be relatively high, otherwise the light intensity of each focal point in the microlens array is not uniform, causing large processing accuracy errors; the light source lattice of the microlens array is fixed and cannot be adjusted. And the gap of the microlens array will generate unwanted stray light

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