Halogen-free epoxy adhesive for polyethylene terephthalate (PET) protective film or insulation layer and preparation method thereof
An epoxy adhesive and insulating layer technology, applied in the direction of online phenolic epoxy resin adhesive, adhesive, epoxy resin glue, etc., can solve the problems of poor heat resistance, poor flame retardancy, and inability to meet the requirements of non-halogenation , to achieve the effect of high heat resistance
Active Publication Date: 2010-12-08
无锡宏仁电子材料科技有限公司
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Problems solved by technology
Since halogenated epoxy resin uses halogen elements in the resin for flame retardancy, it cannot meet the requirements of halogen-free
In addition, polyester resins are mainly divided into halogenated and halogen-free. The latter has poor flame retardancy or no flame retardancy, so the former is generally used, but halogenated polyester resins also use halogen elements in the resin for flame retardancy, so Can not meet the requirements of non-halogenated
At the same time, due to the poor heat resistance of polyester resin, it is easy to deform after being heated, and it is easy to soften and deform even at lower temperatures, and its flame resistance is poor, so it is difficult to meet the application requirements of FPC and FFC terminals for heat resistance.
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[0023] A kind of halogen-free epoxy adhesive suitable for PET protective film or insulating layer disclosed by the present invention is made of the following raw materials according to the mass ratio:
[0024] Halogen-free epoxy resin 30~50,
[0025] Solvent 20~60,
[0026] Toughener 20~35,
[0027] Flame retardant 10~30,
[0028] Curing agent 1~5,
[0029] Accelerator 0.01~1.
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Abstract
The invention discloses a halogen-free epoxy adhesive for a PET protective film or an insulation layer, which is prepared from the following raw materials in part by mass: halogen-free epoxy resin of 30 to 50, solvent of 20 to 60, flexibilizer of 20 to 35, flame retardant of 10 to 30, curing agent of 1 to 5 and promoter of 0.01 to 0.1. A preparation method of the halogen-free epoxy adhesive comprises the following steps of: adding the halogen-free epoxy resin and the solvent into a container according to a mass ratio of 100: 50, stirring till the mixed materials are dissolved completely and recoding the obtained product as a component A; adding the flexibilizer and the solvent into the container according to a mass ratio of 100: 100, stirring till the mixed materials are dissolved completely and recoding the obtained product as a component B; and mixing the component A, the component B, the flame retardant, the curing agent and the promoter according to a mass ratio of (45-60): (40-70): (10-30): (1-5): (0.01-0.1) and uniformly stirring the mixture to obtain the halogen-free epoxy adhesive. Tests show that the halogen-free epoxy adhesive has the heat-resistance temperature of 288 DEG C and the flame-resistance grade of UL94VTM-0 and meets the application requirements of flexible printed circuit (FPC) and flexible flat cable (FFC) terminals on heat resistance, insulation and flame resistance.
Description
technical field [0001] The invention relates to a halogen-free epoxy adhesive suitable for PET protective films or insulating layers, and relates to the raw material formula and preparation method of the halogen-free epoxy adhesive. Background technique [0002] In the prior art, the main resin used for PET (polyethylene terephthalate) protective film or insulating layer adhesive for FPC flexible circuit board or FFC flexible flat cable is generally prepared with halogen epoxy resin or polyester resin. . Since the halogen-containing epoxy resin uses the halogen element in the resin for flame retardancy, it cannot meet the halogen-free requirements. In addition, polyester resins are mainly divided into halogenated and halogen-free. The latter has poor flame retardancy or no flame retardancy, so the former is generally used, but halogenated polyester resins also use halogen elements in the resin for flame retardancy, so Can not meet the requirements of non-halogenation. At ...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/08C09J9/00
Inventor 邹威施忠仁杨丰彰向必军芦卫东徐群星
Owner 无锡宏仁电子材料科技有限公司
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