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Macromolecule thermal-conducting composite material and preparation method thereof

A heat-conducting composite material and polymer technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of high cost, easy decomposition, poor temperature resistance, etc., and achieve low cost, good dielectric properties, and heat conduction Good effect on coefficient properties

Inactive Publication Date: 2010-12-22
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, thermal conductivity materials with high thermal conductivity appearing on the market are achieved by adding a large amount of silver powder or even diamond powder to the resin. Due to the price of silver powder and diamond powder, the cost is very high, which limits the use of this type of product
Thermal phase change is generally achieved by adding thermally conductive fillers to paraffin substances and using PVC substances as supporting materials. This type of material has poor temperature resistance and is easy to decompose at high temperatures.

Method used

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  • Macromolecule thermal-conducting composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Accurately weigh 95g of silicone resin, 4g of curing agent and 1g of catalyst, add the above components into a double planetary power mixer and stir for 30 minutes to obtain a matrix resin, add the components of thermally conductive fillers to the above mixture, first add spherical alumina 490g, stirred for 30 minutes, added 210g of zinc oxide whiskers, stirred for 30 minutes, stirred at a vacuum of -0.1MPa for 30 minutes, coated the mixture into a film with a thickness of 2mm, and cured at 60°C for 10 minutes to obtain the product;

[0030] Wherein, the silicone resin is a linear silicone resin, and its structural formula is: CH 2 =CH-Si(CH 3 ) 2 O[(CH 3 ) 2 SiO] 200 (CH 3 ) 2 Si-CH=CH 2 ; The curing agent is a hydrogen-containing silicone oil curing agent, and its structural formula is; CH 3 -Si(CH 3 ) 2 -O-[SiHCH 3 -O] 2 -[Si-(CH 3 ) 2 -O] 6 -Si(CH 3 ) 2 -CH 3 .

Embodiment 2

[0032] Accurately weigh 97g of silicone resin, 2g of curing agent and 1g of catalyst, add the above components into a double planetary power mixer and stir for 30 minutes to obtain a matrix resin, add the components of thermally conductive fillers to the above mixture, first add spherical alumina Mix at 650°C for 30 minutes, add 100g of zinc oxide whiskers, stir for 30 minutes, and stir for 30 minutes at a vacuum of -0.1MPa, coat the mixture into a film with a thickness of 2mm, and cure at 60°C for 10 minutes to obtain the product.

[0033] Wherein, the silicone resin is a linear silicone resin, and its structural formula is CH 2 =CH-Si(CH 3 ) 2 O[(CH 3 ) 2 SiO] 150 (CH 3 ) 2 Si-CH=CH 2 ; The curing agent is a hydrogen-containing silicone oil curing agent, and its structural formula is: CH 3 -Si(CH 3 )2 -O-[SiHCH 3 -O] 10 -[Si-(CH 3 ) 2 -O] 40 -Si(CH 3 ) 2 -CH 3 .

Embodiment 3

[0035] Accurately weigh 98.9g of silicone resin, 1g of curing agent and 0.1g of catalyst, add the above components into a double planetary power mixing mixer and stir for 45 minutes to obtain a matrix resin, add thermally conductive filler components to the above mixture, first add spherical oxide 900g of aluminum, stirred for 45 minutes, added 50g of zinc oxide whiskers, stirred for 45 minutes, stirred at a vacuum of -0.1MPa for 45 minutes, coated the mixture into a film with a thickness of 2mm, and cured at 90°C for 20 minutes to obtain the product.

[0036] Wherein, the silicone resin is a linear silicone resin, and its structural formula is: CH 2 =CH-Si(CH 3 ) 2 O[(CH 3 ) 2 SiO] 200 (CH 3 ) 2 Si-CH=CH 2 ; The curing agent is a hydrogen-containing silicone oil curing agent, and its structural formula is: CH 3 -Si(CH 3 ) 2 -O-[SiHCH 3 -O] 30 -[Si-(CH 3 ) 2 -O] 68 -Si(CH 3 ) 2 -CH 3 .

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Abstract

The invention relates to a macromolecule thermal-conducting composite material and a preparation method thereof. The macromolecule thermal-conducting composite material comprises two parts of matrix resin and a heat conductive filler with the weight proportion of 100:700-110:1100. The matrix resin comprises the following raw materials in percentage by weight: 95-99 percent of organic silicon resin, 1-4 percent of curing agent and 0.1-1 percent of catalyst; and the heat conductive filler comprises the following raw materials in percentage by weight: 70-95 percent of spherical filler and 5-30 percent of needle-like filler. The preparation method comprises the steps of: sequentially adding the organic silicon resin, the curing agent and the catalyst into a mixer, mixing to obtain the matrix resin; then mixing the matrix resin with the heat conductive filler by the proportion of 100:700-100:1100, wherein in the process of the heat conductive filler addition, 70-95 percent of the spherical filler is added firstly and the 5-30 percent of needle-like filler is added subsequently; and stirring for mixing, smearing to form a film, and curing to obtain the composite material.

Description

technical field [0001] The invention relates to a heat-conducting composite material, in particular to a polymer heat-conducting composite material and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] At present, the assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature. Every time the temperature of electronic components increases by 2°C, its reliability will decrease by 10%. Therefore, timely heat dissipation becomes an important factor affecting its service life. With the miniaturization and functional integration of electronic products, the internal structure of electronic devices is becoming more and more complex, the density of components is getting higher and higher, the heat generation is getting bigger and bigger, and the requirements for thermally conductive materials are getting higher and higher. [0003] The thermal conductive ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K7/18C08K7/08C08K7/10C09K5/14
Inventor 石红娥王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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