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Processing oil for brittle material

A technology for brittle materials and processing oils, applied in additives, petroleum industry, lubricating compositions, etc., can solve the problems of difficult uniformity of wafer thickness, supply of slurry, cutting marks, etc., and achieve the effect of improving processing accuracy

Inactive Publication Date: 2014-07-23
IDEMITSU KOSAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, semiconductor products, etc. have tended to be larger and more integrated, and it is necessary to improve the performance of processing oils.
That is, wire saw processing requires processing large materials with higher precision than before, but when using conventional processing oil, it is difficult to sufficiently supply slurry to the processing gap
Therefore, when cutting the silicon ingot, there are problems such as that the cutting surface is easy to produce saw marks and the thickness of the wafer is difficult to be uniform.

Method used

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  • Processing oil for brittle material
  • Processing oil for brittle material

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Experimental program
Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～10

[0039] Process oils of the compositions shown in Table 1 were prepared.

[0040] [Table 1]

[0041]

[0042] Base oil: Mineral oil (Kinematic viscosity at 40°C: 3.3mm 2 / s)

[0043] Ester compound 1: polyoxyethylene sorbitan trioleate (addition mole number 20)

[0044] Ester compound 2: polyoxyethylene sorbitan monolaurate (addition mole number 20)

[0045] Ester compound 3: polyoxyethylene glycerol monoisostearate (addition mole number 10)

[0046] Ester compound 4: polyoxyethylene sorbitan monolaurate (addition mole number 6)

[0047] Ester compound 5: polyoxyethylene sorbitan monooleate (addition mole number 6)

[0048] Ester compound 6: sorbitan monolaurate (addition mole number 0)

[0049] Ether compound 1: polyoxyethylene lauryl ether (addition mole number 6)

[0050] Ether compound 2: polyoxyethylene oleyl ether (addition mole number 6)

[0051] Fatty acid salt 1: N-(2-hydroxyethyl)piperazine salt of oleic acid

[0052] Bentonite: Niu-Dolben (manufactured by...

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Abstract

Disclosed is a processing oil for a brittle material, which can supply a slurry satisfactorily to a gap to be processed, and has excellent processability. Specifically disclosed is a processing oil for a brittle material, which comprises (a) a base oil, (b) a nonionic surfactant which is an alkylene oxide adduct of a polyhydric alcohol having a valency of 2 to 6 and has the molar number of alkylene oxide units added of 2 to 50 and / or a nonionic surfactant which is a derivative of an alkylene oxide adduct of a polyhydric alcohol having a valency of 2 to 6 and has the molar number of alkylene oxide units added of 2 to 50, and (c) bentonite, wherein the contents of the components (b) and (c) are 0.2 to 30 mass% and 0.1 to 10 mass%, respectively, relative to the total amount of the processing oil.

Description

technical field [0001] The present invention relates to a processing oil for a brittle material, and more particularly, to a processing oil for a brittle material suitable for cutting the brittle material with a wire saw using free abrasive grains. Background technique [0002] In the manufacture of semiconductor products, it is important to process a silicon ingot, which is a brittle material, with high precision, and in cutting the silicon ingot, a wire saw is usually processed from the viewpoint of machining accuracy and productivity. Generally, in wire saw processing, a brittle material is cut by a wire saw containing piano wire or the like using a slurry obtained by dispersing free abrasive grains in processing oil. Therefore, in addition to lubricating performance and cooling performance, dispersing performance of free abrasive particles and ease of washing after processing are also required for this processing oil. Various techniques have so far been developed for th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M145/26C10M125/30C10M145/38C10N20/02C10N30/00C10N40/22C10N40/32
CPCC10N2240/50C10M2207/289C10M2201/103C10M2207/126C10M169/04C10N2230/02C10M2209/104C10N2030/02C10N2040/32C10M2215/221C10M2209/108C10M2209/109
Inventor 北村友彦
Owner IDEMITSU KOSAN CO LTD
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