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High-frequency resin composition and high-frequency circuit substrate manufactured by using same

A technology of resin composition and circuit substrate, which is applied in the direction of circuit substrate materials, printed circuit parts, layered products, etc., can solve the problems of poor manufacturability, etc., and achieve the effect of overcoming poor heat and humidity resistance, strong rigidity, and excellent dielectric properties

Active Publication Date: 2011-02-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, in order to further optimize the dielectric properties, polyphenylene ether resin was introduced, but there were problems such as poor manufacturability in the process of introducing polyphenylene ether resin

Method used

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  • High-frequency resin composition and high-frequency circuit substrate manufactured by using same
  • High-frequency resin composition and high-frequency circuit substrate manufactured by using same
  • High-frequency resin composition and high-frequency circuit substrate manufactured by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Take a container, add 60 parts by weight of NC-2000L, then add 20 parts by weight of HF-CE and 20 parts by weight of 9460S, stir, add an appropriate amount of accelerator zinc octoate and DMAP, and dissolve toluene, continue to stir evenly to form a gel liquid. Immerse the above glue with glass fiber cloth and control it to a suitable thickness, then dry it to remove the solvent to make a prepreg. Using several prepared prepregs to stack each other, press a copper foil on each side of the prepregs, put them into a hot press machine and solidify to form the high-frequency circuit substrate. The physical data are shown in Table 1.

Embodiment 2

[0067] The manufacturing process is the same as in Example 1, and the formula composition and physical property data are as shown in Table 1.

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PUM

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Abstract

The invention relates to a high-frequency resin composition and a high-frequency circuit substrate manufactured by using the same. The high-frequency resin composition comprises the following solid components: (A) an ethylene rhodanate compound with a molecule comprising at least two cyanato bases or a preformed polymer thereof; (B) active ester and (C) epoxy resin with a molecule comprising at least one arylidene alkyl. According to the weight parts of the solid components, the total weight of the ethylene rhodanate compound with the molecule comprising at least two cyanato bases or the preformed polymer thereof in the component (A) and the active ester of the component (B) is 10-70 parts by weight, the dosage of the epoxy resin with the molecule comprising at least one arylidene alkyl is 30-90 parts by weight in the component (C), and the weight ratio of the ethylene rhodanate compound with the molecule comprising at least two cyanato bases or the preformed polymer thereof in the component (A) and the active ester of the component (B) is 0.2-5:1. The high-frequency circuit substrate manufactured by using the high-frequency resin composition comprises a plurality of layers of mutually-stacked semi-solid pieces and copper foil which is respectively pressed on both sides of the semi-solid piece, wherein the plurality of layers of mutually-stacked semi-solid pieces comprise a base material and a high-frequency resin composition which is attached to the base material after being impregnated and dried.

Description

technical field [0001] The invention relates to a resin composition, in particular to a high-frequency resin composition and a high-frequency circuit substrate made using it. Background technique [0002] The application frequencies of traditional electronic products are mostly concentrated below 1GHz, and the DK / Df characteristics of traditional FR-4 materials are sufficient to meet their requirements. Even if it cannot be met, the requirements can be met by changing the circuit design. However, with the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. Substrate materials will no longer play the role of mechanical support in the traditional sense, but will become PCB and electronic components together with electronic components. An important way for terminal manufacturers and designers to improve product performance. Because a high DK will slow down ...

Claims

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Application Information

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IPC IPC(8): C08G59/40B32B15/092C08L63/00H05K1/03C08G59/42
Inventor 曾宪平张江陵唐军旗
Owner GUANGDONG SHENGYI SCI TECH
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