Device for reducing polymers at back side of substrate
A technology of polymers and substrates, applied in crystal growth, electrical components, climate sustainability, etc., can solve problems such as generation on the back of the substrate, temperature rise of the middle ring, polymer deposition, etc., to improve the speed of heat dissipation, set and positioning reliable and stable effect
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[0041] The following combination Figure 2 to Figure 5 , the present invention will be described in detail through several preferred specific embodiments.
[0042] Such as figure 2 Shown is an embodiment of the device for reducing polymer on the backside of the substrate described in the present invention. In this embodiment, a substrate 2 and a base 1 are provided in the plasma etching chamber for performing plasma etching on the substrate, and a substrate support for installing the substrate 2 is also provided on the upper surface 102 of the base. The substrate support includes an electrostatic chuck 3 usually made of ceramic material and a DC electrode 4 embedded in the electrostatic chuck 3; after the substrate 2 is installed on the substrate support, Its edge protrudes from the edge of the upper surface 102 of the base 1 (and also protrudes from the edge of the electrostatic chuck 3). The plasma etching chamber also includes an insulating ring 11 that is arranged on t...
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