Connection structure of bare chip and printed circuit board, printed circuit board and communication equipment

Abstract

The invention provides a connection structure of a bare chip and a printed circuit board, the printed circuit board and communication equipment, belonging to the communication field. The connection structure comprises the printed circuit board and the bare chip, wherein the printed circuit board at least comprises three conductor layers which are insulated from one another via insulating layers, one conductor layer is a heat substrate, the printed circuit board on the heat substrate is provided with an open chute, the bare chip is arranged on the heat substrate in the open chute, the conductor layers on the printed circuit board at the two sides of the bare chip form mixed type microstrip lines, and the bare chip is electrically connected with the mixed type microstrip lines via multiple bonding wires. By forming the mixed type microstrip lines on the printed circuit board at the two sides of the open chute of the bare chip, the bare chip can conveniently form electric connection withthe mixed type microstrip lines via the bonding wires. The mixed type microstrip lines can ensure the continuity of the physical structure of a transmission line and the connectivity of a reference ground, reflection and loss are avoided, and the scale of an MMW circuit module is improved.

Description

technical field [0001] The invention relates to the communication field, in particular to a connection structure between a bare chip and a printed circuit board, a printed circuit board, and communication equipment. Background technique [0002] Microwave and Millimeter Waves (MMW, Micro and Millimeter Waves) circuits in communication equipment have extremely high operating frequencies, resulting in a sharp increase in signal loss in the circuit, and at the same time, the reflection problem caused by the discontinuity of the circuit impedance is also more serious, and The existence of the reflection problem will lead to the reduction of the signal amplitude obtained at the receiving end, resulting in reflection loss, and the reflection will affect the stability of the circuit operation under certain circumstances. Moreover, since the wavelength of the MMW signal is very short, the radiation ability in space is very strong, and it will also cause crosstalk due to the mutual i...

AI Technical Summary

Problems solved by technology

[0004] However, in a double-layer PCB, only one conductor layer can be used as a circuit layer, and the other layer is used as a thermal substrate and a reference ground. Although the continuity of the physical structure of the transmission line and the connectivity of the reference ground are guaranteed, it cannot achieve a greater The large-scale MMW circuit module makes the current MMW circuit module have a small scale and cannot realize large-scale circuit design

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