Al-Cu transient liquid phase diffusion bonding method of Al alloy

An instantaneous liquid phase and diffusion connection technology, which is applied in the connection of aluminum alloy precision devices, and in the field of Al alloy Al-Cu instantaneous liquid phase diffusion, can solve the problems of unsatisfactory connection performance and shape and position tolerance, so as to avoid the disadvantage of unevenness , The effect of beautiful welding shape and high welding seam connection strength

Active Publication Date: 2011-04-06
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] The method of liquid phase formation in liquid phase diffusion welding, the relevant connection process specifications and the formed intermediate reaction products directly determine the connection performance and shape and position tolerance of the components. The connection performance and shape and position ...

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  • Al-Cu transient liquid phase diffusion bonding method of Al alloy
  • Al-Cu transient liquid phase diffusion bonding method of Al alloy
  • Al-Cu transient liquid phase diffusion bonding method of Al alloy

Examples

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Embodiment

[0030] Example: Instantaneous liquid phase diffusion connection of 6063 aluminum alloy components

[0031] Copper-plate the parts of the pre-soldered device first, the thickness of the coating is 5 μm, the welding temperature is 552°C, and the welding vacuum is 3×10 -3 Pa, pressure 0.02MPa, welding holding time 5min. Product photos such as figure 1 As shown, the product weld structure photo is as follows figure 2 As shown, the device size and the fillet detection of the brazing seam all meet the requirements.

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Abstract

The invention relates to an Al-Cu transient liquid phase diffusion bonding method of Al alloy, comprising the following steps: 1, carrying out pre-welding treatment on a workpiece, mechanically processing the surface of an Al alloy part subject to machine-shaping, and then carrying out ultrasonic cleaning on the aluminum alloy part in acetone to remove greasy dirt and other impurities; 2, preparing an intermediate layer, firstly preplacing a Cu plating layer with the thickness of 310 mu m by a plating mode on the surface of the Al alloy; and 3, placing a workepiece group to be connected to a braze welding furnace according to a required connection mode, applying a balance weight on the sample, heating the workpiece to a temperature ranging from 550 to 560 DEG C, insulating for 1-10min, stopping heating, cooling down the sample along with the furnace to below 200 DEG C, taking out of the sample and cooling in air to room temperature to finish connection, wherein the weight of the balance weight is determined according to the area of the soldered joint by generally taking the weight capable of providing 0.02MPa pressure on the connection surface as a criterion, and the connection environmental requirement is that the vacuum degree is larger than or equal to 4 *10<-3>Pa.

Description

technical field [0001] The invention relates to a connection technology of aluminum alloy precision devices, in particular to an Al alloy Al-Cu instantaneous liquid phase diffusion [0002] The connection method belongs to the technical field of diffusion connection. Background technique [0003] With the lightweight of weapons and equipment and the improvement of technical and tactical indicators, aluminum alloy thin-walled complex components are more and more widely used in the military industry. There are certain problems in the brazing of aluminum alloy thin-walled complex components such as X-band row-column feeders and high-efficiency liquid-cooled modules. During brazing, the fillet R is not easy to control, and local brazing material is easy to partially block the liquid-cooled flow channel or flow on the microwave components. The surface of the inner cavity reduces the performance index of the component and affects the yield of the component. [0004] When dif...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K1/20
Inventor 冯展鹰曹慧丽冯杏梅
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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